QCC-3091-0-WLNSP99-TR-06-0 Bluetooth Audio SoC Tape & Reel

  • Provides core functionality to simplify system design, improve user experience.
  • Key specification on the row indicates performance predictability, design compatibility.
  • Efficient power profile, compact footprint reduce battery drain, save board.
  • In Bluetooth audio headsets, QCC-3091-0-WLNSP99-TR-06-0 enables stable and reliable streaming.
  • Test data shown in the row demonstrate qualification and reliability.
SKU: QCC-3091-0-WLNSP99-TR-06-0 類別: 標籤 , , , , 品牌:
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產品上方詢問盤

QCC-3091-0-WLNSP99-TR-06-0 Overview

The QCC-3091-0-WLNSP99-TR-06-0 is a compact Bluetooth audio system-on-chip (SoC) designed for TrueWireless earbuds and headsets. It delivers integrated audio processing, low-power operation, and on-chip voice features to maximize battery life and reduce bill-of-materials. The device targets manufacturers and design engineers who need a smaller footprint, robust connectivity, and reliable audio performance for consumer and industrial wireless audio products. For component sourcing, see IC 製造商.

QCC-3091-0-WLNSP99-TR-06-0 Technical Specifications

Part NumberQCC-3091-0-WLNSP99-TR-06-0
製造商Qualcomm (QCC series)
裝置類型Bluetooth audio SoC for earbuds and headsets
Audio ProcessingIntegrated DSP for voice, audio post?processing, and mixing
WirelessBluetooth audio connectivity with standard audio profiles support
Power ProfileOptimized for low-power operation and extended battery runtime
包裝Small form-factor surface-mount package suitable for earbud PCBs
IntegrationOn-chip audio codecs, voice processing, and peripherals to reduce external components
典型應用TrueWireless earbuds, stereo headsets, hearables, and portable audio devices
LSI KeywordsBluetooth audio chip, audio SoC, TrueWireless, earbud SoC, ANC processing, low-power DSP, wireless headset IC

QCC-3091-0-WLNSP99-TR-06-0 Key Features

  • Integrated audio DSP that provides high-quality sound processing and lowers external component count for smaller BOM.
  • TrueWireless stereo support to simplify synchronization between left and right earbuds, improving user experience and connection stability.
  • Low-power design that extends battery runtime and enables smaller battery cells without compromising playback time.
  • On-chip voice and audio pre-processing for clear voice calls and improved performance with voice assistants in noisy environments.

QCC-3091-0-WLNSP99-TR-06-0 Advantages vs Typical Alternatives

This SoC offers higher integration and lower system power compared with discrete solutions. It reduces board area, simplifies radio pairing, and lowers BOM cost. For designers seeking compact, battery-efficient TrueWireless solutions, it provides clearer audio processing and fewer external components vs separate MCU + radio designs.

典型應用

  • TrueWireless stereo earbuds that require a compact SoC, integrated audio DSP, and long battery life for continuous music playback.
  • Wireless stereo headsets for voice calls and multimedia, where on-chip voice processing improves call clarity in noisy environments.
  • Hearables and fitness earbuds with limited PCB area, needing low-power audio processing and reliable Bluetooth connectivity throughout workouts.
  • Portable audio devices and in-ear monitors that demand reduced BOM, simplified antenna integration, and consistent stereo synchronization.

QCC-3091-0-WLNSP99-TR-06-0 Brand Info

Part of Qualcomm’s QCC family, this device reflects Qualcomm Technologies’ focus on wireless audio innovation. The QCC line is known for low-power audio SoCs that prioritize integration, connectivity, and audio performance in consumer wearables.

常見問題

What is the primary use?

It is primarily used as a Bluetooth audio SoC for TrueWireless earbuds and similar headsets, offering integrated audio processing and connectivity to simplify product design.

How does it impact battery life?

Designed for low-power operation, the SoC reduces system power draw compared with discrete designs, enabling longer playback from the same battery capacity.

Does it support voice assistants?

Yes. The device includes on-chip voice processing features that enable reliable voice-capture and local pre-processing needed for voice assistant integration.

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產品中間詢盤

What packaging is available?

It is supplied in a compact surface-mount package suited to earbud PCBs and small form-factor consumer devices; check supplier datasheet for exact package code and dimensions.

Where can I source this part?

Authorized distributors and component marketplaces list this part. For production quantities, contact authorized Qualcomm distributors or certified partners for availability and lead times.

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