CYW20730A2KML2G Bluetooth Controller Module, QFN Package

  • Enables Bluetooth wireless connectivity, allowing for seamless device communication in embedded applications.
  • Features a compact KML2G package, which helps reduce board space in densely packed electronic designs.
  • Optimized for low power operation, supporting battery-powered devices with extended usage times.
  • Suitable for use in smart home controls, improving convenience and remote access for users.
  • Manufactured to meet standard quality benchmarks, promoting stable and consistent performance in end products.
SKU: CYW20730A2KML2G 類別: 品牌:
英飛凌標誌
產品上方詢問盤

CYW20730A2KML2G Overview

The CYW20730A2KML2G is a specialized integrated circuit engineered for robust wireless connectivity and control solutions across a variety of industrial and commercial applications. This device is housed in a 32-VFQFN exposed pad package, offering a compact footprint suitable for space-constrained designs. Developed with a focus on reliable performance, stable operation, and ease of integration, this IC is an excellent choice for engineers seeking Bluetooth solutions in demanding environments. For further technical details and procurement support, visit IC 製造商.

CYW20730A2KML2G Technical Specifications

Attribute 價值
Part Number CYW20730A2KML2G
安裝類型 表面貼裝
Package / Case 32-VFQFN Exposed Pad
Packaging Tray
ECCN 5A002.a.1
HTS Code 8542.31.0001
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected

CYW20730A2KML2G Key Features

  • Compact 32-VFQFN exposed pad package enables high-density PCB layouts, saving valuable board space in complex designs.
  • Surface mount configuration simplifies automated assembly processes, improving production efficiency and consistency.
  • ROHS3 compliance ensures environmental responsibility and supports global market access.
  • ECCN 5A002.a.1 listing underlines its advanced security and communication capabilities, making it suitable for regulated industries.

CYW20730A2KML2G Advantages vs Typical Alternatives

This device offers a significant edge over typical alternatives by combining a compact package with advanced compliance standards such as ROHS3 and REACH. Its surface mount design streamlines manufacturing, while the exposed pad enhances thermal dissipation. The classification under ECCN 5A002.a.1 also signifies suitability for secure wireless applications, providing robust and reliable performance in industrial environments.

典型應用

  • Wireless control modules in industrial automation systems benefit from the device??s reliable connectivity and compact footprint, ensuring consistent performance in demanding environments.
  • Consumer electronics, such as smart home equipment, utilize its small form factor and compliance features for seamless wireless integration.
  • Medical devices requiring secure and stable wireless communication can leverage its advanced classification and robust packaging.
  • Asset tracking solutions or beacons in logistics and supply chain management can take advantage of its reliability and ease of assembly.

CYW20730A2KML2G Brand Info

The CYW20730A2KML2G is offered by a trusted supplier committed to quality and innovation in wireless communication ICs. This product is tailored for customers demanding high standards in compliance, reliability, and integration flexibility. Its design reflects market trends toward miniaturization and regulatory adherence, making it a preferred choice for OEMs and engineers worldwide.

常見問題

What is the package type and why is it beneficial for modern designs?

This IC is supplied in a 32-VFQFN exposed pad package, which is highly advantageous for compact PCB layouts. The exposed pad further aids in thermal management, making it ideal for high-density, thermally demanding applications.

Is the CYW20730A2KML2G compliant with environmental regulations?

Yes, it is ROHS3 compliant and its REACH status is unaffected. This ensures the device meets stringent environmental and safety standards, supporting global market access and sustainability initiatives.

What is the moisture sensitivity level (MSL) of this device?

The moisture sensitivity level is rated at MSL 3 (168 hours), indicating the device must be mounted within 168 hours of opening the package in a controlled environment to prevent moisture-induced damage during reflow soldering.

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產品中間詢盤

How does the ECCN code affect its use in secure applications?

With an ECCN classification of 5A002.a.1, this IC is recognized for its suitability in secure communication applications, often required in industries with strict regulatory controls and data protection needs.

What are typical use environments for the CYW20730A2KML2G?

Its robust design and compliance features make it suitable for industrial automation, consumer electronics, medical devices, and asset tracking. The device??s technical attributes support stable operation in diverse and challenging environments.

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