BCM43569YKAKRFBHT Overview
The BCM43569YKAKRFBHT is a highly integrated Wi-Fi 6 and Bluetooth 5.2 combo chip designed to deliver robust wireless connectivity in compact form factors. Featuring dual-band 2.4 GHz and 5 GHz support with enhanced modulation schemes, this device enables high-throughput, low-latency data transfer for industrial, consumer, and IoT applications. Its advanced coexistence mechanisms and power efficiency enhance system reliability and battery life. This solution is ideal for engineers and sourcing specialists seeking a scalable, high-performance wireless module from a reputable IC 製造商 with proven wireless expertise.
BCM43569YKAKRFBHT Technical Specifications
| 參數 | 規格 |
|---|---|
| Wireless Standards Supported | IEEE 802.11ax (Wi-Fi 6), Bluetooth 5.2 |
| Frequency Bands | 2.4 GHz and 5 GHz dual-band operation |
| Modulation Schemes | OFDM 1024-QAM, BPSK, QPSK, 16-QAM, 64-QAM, 256-QAM |
| Maximum Data Rate | Up to 1.2 Gbps (aggregate) |
| Host Interface | SDIO 3.0, SPI |
| 操作電壓 | 3.3 V typical |
| 包裝類型 | 33-pin BGA |
| 操作溫度範圍 | -40°C 至 +85°C |
| 電源管理 | Integrated power-saving modes with dynamic power scaling |
BCM43569YKAKRFBHT Key Features
- Dual-band Wi-Fi 6 support: Enables high-speed wireless connectivity with improved spectral efficiency for demanding applications.
- Bluetooth 5.2 integration: Provides enhanced data throughput and longer range for seamless device communication.
- Advanced coexistence technology: Minimizes interference between Wi-Fi and Bluetooth transmissions, ensuring stable and reliable connections.
- 低功耗： Incorporates power-saving features that extend device battery life in portable and embedded systems.
- Compact BGA package: Facilitates easy integration into space-constrained designs without compromising performance.
- High data throughput: Supports up to 1.2 Gbps aggregate throughput, ideal for bandwidth-intensive industrial and consumer applications.
- Robust operating range: Designed to function reliably across extended industrial temperature ranges for versatile deployment.
BCM43569YKAKRFBHT Advantages vs Typical Alternatives
This highly integrated solution offers superior wireless coexistence and power efficiency compared to typical combo chips. Its support for Wi-Fi 6 and Bluetooth 5.2 ensures enhanced data rates and extended range, while advanced interference mitigation delivers reliable connectivity. The compact package and broad temperature tolerance make it well suited for diverse industrial and IoT environments, providing engineers with a streamlined, flexible option that outperforms many legacy wireless ICs.
暢銷產品
典型應用
- Industrial automation and control systems requiring reliable dual-band wireless connectivity with extended temperature operation and low latency.
- Consumer electronics such as smart TVs and set-top boxes benefiting from high-speed Wi-Fi 6 and Bluetooth 5.2 integration.
- IoT devices needing compact, energy-efficient wireless communication modules to enable smart home and smart city connectivity.
- Healthcare and medical equipment requiring robust and interference-resistant wireless data transmission for monitoring and diagnostics.
BCM43569YKAKRFBHT Brand Info
The BCM43569YKAKRFBHT is developed by a leading semiconductor company known for its innovation in wireless connectivity solutions. This product embodies the brand??s commitment to delivering high-performance, integrated wireless ICs optimized for next-generation Wi-Fi and Bluetooth standards. Designed for scalability and reliability, the device aligns with the company??s portfolio targeting industrial, consumer, and IoT markets. Its adoption underscores trust in proven technology combined with cutting-edge wireless protocols.
常見問題
What wireless standards does this device support?
The device supports the latest Wi-Fi 6 standard (IEEE 802.11ax) and Bluetooth 5.2. This enables high data throughput, improved spectral efficiency, and enhanced range compared to previous wireless versions.
精選產品
How does the chip handle coexistence between Wi-Fi and Bluetooth?
It incorporates advanced coexistence mechanisms that reduce interference between Wi-Fi and Bluetooth radios. This ensures stable and simultaneous operation of both wireless functions without performance degradation.
What are the power management capabilities of this wireless IC?
The device features integrated power-saving modes, including dynamic power scaling, to optimize energy consumption. These capabilities help extend battery life in portable and embedded systems while maintaining wireless performance.
聯絡我們
What packaging options are available for this chip?
This wireless IC comes in a compact 33-pin Ball Grid Array (BGA) package. The small footprint facilitates integration into space-constrained designs common in modern industrial and consumer electronics.
Is this chip suitable for extended temperature industrial environments?
Yes, it is designed to operate reliably across a broad temperature range from -40??C to +85??C, making it suitable for demanding industrial and outdoor applications.
