BCM43520KMLG Overview
The BCM43520KMLG is a highly integrated wireless connectivity solution designed for advanced Wi-Fi and Bluetooth applications. This device supports simultaneous dual-band 2.4 GHz and 5 GHz operation, delivering robust communication capabilities crucial for modern industrial and consumer electronics. It combines low power consumption with high data throughput, ensuring efficient performance in compact form factors. With integrated RF front-end components, the module simplifies system design and accelerates time-to-market. Engineers and sourcing specialists will find this product suitable for embedded wireless networking applications requiring reliability and compliance with industry standards. For complete product details and support, visit IC 製造商.
BCM43520KMLG Technical Specifications
| 參數 | 規格 |
|---|---|
| Wireless Standards Supported | IEEE 802.11a/b/g/n/ac, Bluetooth 5.0 |
| Frequency Bands | 2.4 GHz and 5 GHz dual-band |
| Peak Data Rate | Up to 867 Mbps (802.11ac) |
| Transmit Power | Up to 20 dBm (typical) |
| 包裝類型 | MLP (Multi-Layer Package) |
| 操作電壓 | 3.3 V nominal |
| Interface Support | SDIO 3.0, UART, PCM |
| 操作溫度範圍 | -40°C 至 +85°C |
| Integrated Components | Wi-Fi MAC/PHY, Bluetooth Baseband, RF Front-End |
BCM43520KMLG Key Features
- Dual-Band Wi-Fi Operation: Supports both 2.4 GHz and 5 GHz bands simultaneously, enabling higher throughput and reduced interference in congested wireless environments.
- Bluetooth 5.0 Support: Provides improved range and data rates for Bluetooth applications, enhancing connectivity options for IoT and embedded systems.
- Integrated RF Front-End: Minimizes external components and reduces PCB space, simplifying wireless module integration and lowering overall system cost.
- 低功耗： Optimized for battery-powered and portable devices, the device extends operational life while maintaining robust wireless performance.
- High Data Throughput: Supports 802.11ac with up to 867 Mbps data rates, ensuring fast and reliable wireless communication for demanding applications.
- 寬工作溫度範圍： Suitable for industrial environments with temperature tolerance from -40??C to +85??C, ensuring reliability in harsh conditions.
BCM43520KMLG Advantages vs Typical Alternatives
This wireless module offers superior integration by combining Wi-Fi and Bluetooth functions with an RF front-end in a compact package. Compared to typical solutions, it delivers enhanced sensitivity and higher throughput while maintaining low power consumption. Its robust dual-band operation reduces interference and improves connection stability. The extended temperature range and multi-interface support provide greater design flexibility and reliability, making it advantageous for industrial and embedded applications.
暢銷產品
典型應用
- Embedded wireless communication in industrial automation systems, where reliable dual-band Wi-Fi and Bluetooth connectivity is essential for remote monitoring and control.
- IoT devices requiring low power wireless communication with high data throughput and coexistence of Wi-Fi and Bluetooth protocols.
- Consumer electronics such as smart home devices, where seamless wireless connectivity and compact integration reduce design complexity.
- Portable medical equipment needing robust wireless links in varying environmental conditions and compact form factors.
BCM43520KMLG Brand Info
The BCM43520KMLG is developed by a leading semiconductor manufacturer specializing in wireless communication ICs. This product line is known for delivering high-performance connectivity solutions that combine advanced wireless protocols with integrated RF components. Designed to meet the rigorous demands of industrial and consumer markets, the device reflects the brand??s commitment to innovation, quality, and reliability. Its design supports rapid deployment in various embedded systems, providing engineers with a dependable and versatile wireless module.
常見問題
What wireless standards does this module support?
The module supports IEEE 802.11a/b/g/n/ac Wi-Fi standards and Bluetooth 5.0. This enables it to operate on both legacy and current wireless protocols, providing compatibility with a wide range of devices and applications.
精選產品
What are the primary interfaces available for communication?
It supports SDIO 3.0 for Wi-Fi data transfer, UART for serial communication, and PCM for audio interface. These interfaces allow flexible integration into various system architectures.
What temperature range does this module operate within?
The device is rated for operation from -40??C to +85??C, making it suitable for industrial and outdoor applications where temperature extremes may be encountered.
聯絡我們
How does the integrated RF front-end benefit system design?
By including the RF front-end within the module, the design reduces the need for additional external components, which simplifies PCB layout, lowers assembly costs, and improves overall reliability.
Can this module support simultaneous Wi-Fi and Bluetooth operation?
Yes, the module supports concurrent operation of dual-band Wi-Fi and Bluetooth 5.0, allowing seamless wireless communication across both protocols without performance degradation.
