XCZU7EV-1FBVB900E FPGA Development Module – High Performance Package

  • The XCZU7EV-1FBVB900E delivers high-performance processing for complex applications.
  • Features advanced processing capabilities, enhancing computational efficiency and speed.
  • Compact package type enables effective use of board space in tight designs.
  • Ideal for embedded systems, improving responsiveness in real-time applications.
  • Designed for durability and consistent performance under various conditions.
SKU: XCZU7EV-1FBVB900E FPGA Development Module - High Performance Package 类别 品牌:
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XCZU7EV-1FBVB900E Overview

The XCZU7EV-1FBVB900E is a high-performance, versatile system-on-chip (SoC) designed for demanding applications in the industrial and automotive sectors. It integrates advanced processing capabilities with a rich set of input/output options, providing engineers with the flexibility needed to optimize their designs. This device supports multiple protocols and offers significant computational power, making it suitable for various applications from machine learning to real-time processing. For more information, visit 集成电路制造商.

XCZU7EV-1FBVB900E Key Features

  • High-performance processing: The device features multiple processing cores, enabling complex computation and real-time data processing, crucial for applications requiring rapid decision-making.
  • Advanced I/O capabilities: With support for various communication protocols, the XCZU7EV-1FBVB900E allows seamless integration into existing systems, enhancing interoperability and reducing design time.
  • Enhanced power efficiency: This SoC is optimized for low power consumption without compromising performance, making it ideal for battery-operated devices and reducing overall operational costs.
  • Scalability: The architecture is designed to accommodate future upgrades and expansions, ensuring longevity and adaptability in evolving technology landscapes.

XCZU7EV-1FBVB900E Technical Specifications

参数 价值
Core Count Multiple processing cores
最大时钟频率 1.5 GHz
Fabrication Process 16 nm
RAM Type DDR4
Storage Interface QSPI, SDIO
温度范围 -40??C to +100??C
电源电压 1.0V – 1.2V
包装类型 FBGA

XCZU7EV-1FBVB900E Advantages vs Typical Alternatives

The XCZU7EV-1FBVB900E stands out against typical alternatives due to its superior processing capabilities, allowing for faster data handling and lower latency. Additionally, its efficient power management features ensure optimal performance while minimizing energy consumption, benefiting both cost and environmental impact.

典型应用

  • 工业自动化: Suitable for controlling complex machinery and processes, the SoC can handle multiple inputs and outputs, improving overall operational efficiency.
  • Automotive Systems: Designed for advanced driver-assistance systems (ADAS), enhancing safety and reliability.
  • Machine Learning: Ideal for real-time data analysis, enabling smarter decision-making processes.
  • Telecommunications: Supports high-speed data transfer and processing, essential for modern communication networks.

XCZU7EV-1FBVB900E Brand Info

The XCZU7EV-1FBVB900E is part of a renowned family of high-performance SoCs designed to meet the rigorous demands of various industries. This product line is celebrated for its reliability, extensive support for diverse applications, and commitment to innovation, making it a preferred choice among engineers and developers worldwide.

常见问题

What are the main features of the XCZU7EV-1FBVB900E?

This device features advanced processing capabilities, multiple I/O options, and enhanced power efficiency, making it suitable for a wide range of applications including industrial automation and machine learning.

How does the XCZU7EV-1FBVB900E perform in low-power applications?

The design of this SoC significantly reduces power consumption while maintaining high performance, making it ideal for applications where energy efficiency is crucial.

What industries can benefit from using the XCZU7EV-1FBVB900E?

Industries such as automotive, telecommunications, and industrial automation can leverage this device for its robust processing capabilities and flexibility in various applications.

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Is the XCZU7EV-1FBVB900E customizable?

Yes, the architecture allows for scalability and customization, enabling engineers to tailor the device to meet specific application requirements and future upgrades.

What is the expected lifespan of the XCZU7EV-1FBVB900E?

Given its robust design and high-quality materials, the SoC is expected to have a long operational lifespan, making it a wise investment for long-term projects.

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