BCM43566PKFFBG0 Overview
The BCM43566PKFFBG0 is a high-performance wireless connectivity solution designed for advanced industrial and consumer electronics applications. It integrates dual-band 2.4 GHz and 5 GHz Wi-Fi 5 (802.11ac) capabilities with Bluetooth 5.0 in a compact package, enabling robust, multi-protocol communication. Its low power consumption and advanced features support seamless data throughput and enhanced reliability in challenging RF environments. This module is ideal for device manufacturers seeking efficient wireless integration with minimal board space. For more detailed information and procurement, visit 集成电路制造商.
BCM43566PKFFBG0 Technical Specifications
| 参数 | 规格 |
|---|---|
| Wireless Standards | IEEE 802.11a/b/g/n/ac, Bluetooth 5.0 |
| Frequency Bands | 2.4 GHz and 5 GHz dual-band |
| Max Wi-Fi Data Rate | Up to 433 Mbps (802.11ac) |
| Bluetooth Profile Support | Classic and Low Energy (BLE) |
| Transmit Power | Up to +20 dBm |
| Receiver Sensitivity | -95 dBm (typical for 802.11ac) |
| 包装类型 | Fine-pitch Ball Grid Array (FBGA) |
| 工作电压 | 3.3 V |
| 工作温度范围 | -40°C 至 +85°C |
| 界面 | SDIO 3.0, UART, PCM |
BCM43566PKFFBG0 Key Features
- Dual-Band Wi-Fi 5 Support: Enables high-speed data transmission on both 2.4 GHz and 5 GHz bands, ensuring flexible and reliable wireless connectivity in congested environments.
- Integrated Bluetooth 5.0: Supports both Classic and BLE modes, facilitating versatile device communication and low-energy operation for IoT applications.
- 低功耗： Optimized power management reduces energy use during active and standby modes, extending device battery life in portable applications.
- High Receiver Sensitivity: Enhances signal reception and communication range, improving overall wireless link quality in industrial and consumer devices.
- Compact FBGA Package: Minimizes PCB footprint, allowing seamless integration into space-constrained designs without compromising performance.
- Multiple Interface Options: Supports SDIO for Wi-Fi, UART for Bluetooth control, and PCM for audio, enabling flexible system-level integration.
- 坚固的工作温度范围： Suitable for industrial environments, ensuring reliable operation from -40??C to +85??C.
BCM43566PKFFBG0 Advantages vs Typical Alternatives
This wireless module offers superior integration by combining dual-band Wi-Fi 5 and Bluetooth 5.0 in a single compact package, reducing board complexity compared to separate solutions. Its low power consumption and high receiver sensitivity enhance energy efficiency and signal reliability, making it advantageous for industrial and embedded applications requiring consistent wireless performance under challenging conditions.
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典型应用
- Industrial IoT Gateways and Controllers: Enables reliable wireless connectivity for sensor data aggregation and remote device management in harsh environments.
- Smart Home Devices: Provides seamless Wi-Fi and Bluetooth connectivity for smart appliances, lighting controls, and security systems.
- Wearable Electronics: Supports Bluetooth Low Energy and Wi-Fi for health monitoring and fitness tracking devices requiring compact, power-efficient modules.
- Embedded Computing Platforms: Integrates into single-board computers and embedded systems to deliver versatile wireless communication capabilities.
BCM43566PKFFBG0 Brand Info
This module is manufactured by a leading semiconductor company specializing in wireless connectivity solutions. The product line is known for high-quality integration of Wi-Fi and Bluetooth technologies, targeting industrial and consumer wireless communication markets. The BCM43566PKFFBG0 represents a mature design with proven reliability, backed by comprehensive technical documentation and global support, ensuring seamless adoption in diverse application domains.
常见问题
What wireless standards does the BCM43566PKFFBG0 support?
The device supports IEEE 802.11a/b/g/n/ac for Wi-Fi, covering both legacy and modern wireless protocols, along with Bluetooth 5.0, including both Classic and Low Energy modes. This ensures compatibility with a wide range of wireless networks and Bluetooth-enabled devices.
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What are the typical operating conditions for this module?
It operates reliably within a temperature range of -40??C to +85??C and requires a 3.3 V power supply. These specifications make it suitable for industrial and embedded applications where environmental conditions may vary.
How does this module handle power consumption?
Power management is optimized to reduce consumption during active transmission and standby modes. This efficiency helps extend battery life in portable applications and reduces overall power demands in embedded systems.
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Which interfaces are available for communication and control?
The module supports SDIO 3.0 for Wi-Fi data transfer, UART for Bluetooth control and command interface, and PCM for audio data, providing flexible integration options across various system architectures.
What packaging does the BCM43566PKFFBG0 use, and why is it important?
It is housed in a fine-pitch Ball Grid Array (FBGA) package, which offers a compact footprint and excellent thermal and electrical performance. This packaging is critical for integrating the module into space-constrained designs without compromising signal integrity.
