BCM4343SKUBG Overview
The BCM4343SKUBG is a highly integrated wireless connectivity module designed to deliver robust Wi-Fi and Bluetooth performance in compact embedded systems. Combining dual-band 802.11n Wi-Fi capabilities with Bluetooth 4.0 functionality, it supports simultaneous operation for versatile wireless communication. This module targets applications requiring reliable, low-power wireless data transfer with optimized integration, reducing design complexity and time to market. Its compact footprint and comprehensive feature set make it suitable for industrial, consumer, and IoT device manufacturers seeking efficient and scalable wireless solutions. For detailed product information, visit 集成电路制造商.
BCM4343SKUBG Technical Specifications
| 参数 | 规格 |
|---|---|
| Wireless Standards | IEEE 802.11b/g/n (2.4 GHz), Bluetooth 4.0 |
| Wi-Fi Frequency Bands | 2.4 GHz |
| Maximum Wi-Fi Data Rate | Up to 72.2 Mbps (802.11n HT20) |
| Bluetooth Profiles Supported | Classic Bluetooth and Bluetooth Low Energy (BLE) |
| Host Interface | SDIO 2.0 for Wi-Fi, UART for Bluetooth |
| 工作电压 | 3.3 V ?? 0.3 V |
| 工作温度范围 | -40°C 至 +85°C |
| 包装类型 | Surface-mount module, 22.5 mm x 13.5 mm |
BCM4343SKUBG Key Features
- Dual-band Wi-Fi and Bluetooth Integration: Enables simultaneous Wi-Fi and Bluetooth communication, reducing PCB space and simplifying wireless designs.
- 低功耗： Optimized for energy efficiency, extending battery life in portable and embedded devices.
- High Data Throughput: Supports 802.11n HT20 with data rates up to 72.2 Mbps, ensuring reliable high-speed wireless connectivity.
- Robust Host Interfaces: SDIO 2.0 and UART interfaces provide flexible and efficient connectivity to host processors.
- 工作温度范围广： Suitable for industrial environments requiring reliable performance from -40??C to +85??C.
- Compact Form Factor: Small surface-mount module size enables easy integration into space-constrained designs.
- Comprehensive Bluetooth Support: Supports both Classic Bluetooth and BLE, facilitating broad application compatibility.
BCM4343SKUBG Advantages vs Typical Alternatives
This device offers a highly integrated wireless solution combining dual-band Wi-Fi and Bluetooth within a single compact module. Compared to typical discrete alternatives, it reduces board space and component count, enhancing overall system reliability. Its low power consumption and wide operating temperature range provide superior efficiency and durability for industrial and embedded applications. The inclusion of robust host interfaces ensures seamless integration, making it a preferred choice for engineers seeking optimized wireless performance and simplified design efforts.
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典型应用
- Embedded wireless connectivity for IoT devices, enabling seamless data exchange and remote monitoring in compact form factors.
- Industrial automation systems requiring robust and reliable Wi-Fi and Bluetooth communication under harsh temperature conditions.
- Consumer electronics such as smart home appliances that benefit from integrated wireless capabilities for enhanced user experience.
- Portable medical devices where low power consumption and reliable wireless data transfer are critical.
BCM4343SKUBG Brand Info
The BCM4343SKUBG is a product developed by a leading semiconductor manufacturer known for its expertise in wireless communication solutions. This module represents a strategic integration of Wi-Fi and Bluetooth technologies tailored for embedded applications. The brand emphasizes quality, performance, and design flexibility, supporting engineers with comprehensive documentation and reliable components designed to accelerate product development cycles. Its strong market presence and proven technology make it a trusted choice for industrial and consumer wireless applications.
常见问题
What wireless standards does this module support?
The module supports IEEE 802.11b/g/n Wi-Fi standards operating in the 2.4 GHz band, along with Bluetooth 4.0, which includes both Classic Bluetooth and Bluetooth Low Energy (BLE) functionalities. This ensures compatibility with a wide range of wireless devices and networks.
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How does the module interface with host processors?
Wi-Fi connectivity is provided through an SDIO 2.0 interface, which offers efficient data transfer and control, while Bluetooth communication uses a UART interface. These standard interfaces allow straightforward integration with most embedded processors and microcontrollers.
What are the power requirements for operation?
The module operates at a supply voltage of 3.3 V with a tolerance of ??0.3 V. This voltage range aligns with typical embedded system power rails, facilitating easy power management and integration without extensive voltage regulation.
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Is this module suitable for harsh environmental conditions?
Yes, it supports an operating temperature range from -40??C to +85??C, making it suitable for industrial applications and other environments where temperature extremes are common, ensuring reliable wireless performance under demanding conditions.
What is the size of the module, and how does it benefit design integration?
The module measures 22.5 mm by 13.5 mm and is designed as a surface-mount device. Its compact footprint helps reduce overall device size and simplifies PCB layout, which is especially valuable for space-constrained applications such as portable or embedded systems.
