ASM6-SR90-AHK0H Overview
The ASM6-SR90-AHK0H is a high-performance semiconductor device designed for industrial and commercial applications requiring precise control and reliable operation. Engineered with advanced manufacturing processes, this component delivers consistent electrical characteristics suited for robust system integration. Its optimized package and thermal specifications ensure efficient heat dissipation, enhancing long-term stability under demanding conditions. Ideal for engineers and sourcing specialists, this product offers an excellent balance of power handling, signal integrity, and ease of implementation. For more detailed insights, visit the 集成电路制造商 网站。
ASM6-SR90-AHK0H Technical Specifications
参数 | 规格 |
---|---|
包装类型 | SMD (Surface Mount Device) |
工作电压 | 3.3 V 至 5 V |
最高工作温度 | +125??C |
Storage Temperature Range | -55°C 至 +150°C |
功率耗散 | Maximum 1.2 W |
Input Signal Frequency Range | Up to 90 kHz |
Response Time | Less than 10 ??s |
ESD Rating | ??4 kV (Human Body Model) |
ASM6-SR90-AHK0H Key Features
- High-frequency operation: Supports input signal frequencies up to 90 kHz, enabling precise and fast response in control systems.
- Wide temperature range: Operates reliably from -55??C to +125??C, making it suitable for harsh industrial environments.
- Low power dissipation: With a maximum power dissipation of 1.2 W, this device ensures energy-efficient performance and reduces thermal management needs.
- Robust ESD protection: Rated for ??4 kV human body model, it offers excellent immunity to electrostatic discharge events, enhancing system reliability.
ASM6-SR90-AHK0H Advantages vs Typical Alternatives
This component offers superior sensitivity and accuracy compared to typical alternatives, particularly in high-frequency applications. Its extended operating temperature range and robust ESD protection improve device longevity and system reliability. Additionally, the low power dissipation reduces cooling requirements, making it an efficient choice for compact and high-density electronic assemblies.
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典型应用
- Industrial automation control systems requiring precise, high-speed signal processing with reliable temperature tolerance and low power consumption.
- Power management circuits in embedded systems where efficiency and thermal performance are critical.
- Signal conditioning modules that benefit from fast response times and robust electrostatic discharge protection.
- Consumer electronics devices demanding compact, surface-mount packages with stable operation across various environmental conditions.
ASM6-SR90-AHK0H Brand Info
The ASM6-SR90-AHK0H is a product from a leading IC manufacturer specializing in advanced semiconductor solutions for industrial and commercial markets. This device exemplifies the brand??s commitment to quality, innovation, and reliable performance. Engineered with precision and manufactured under stringent quality controls, it supports diverse applications requiring stable operation and efficient integration. The brand provides comprehensive technical support and documentation to assist engineers and sourcing specialists with seamless implementation.
常见问题
该设备的最高工作温度是多少?
The maximum operating temperature is +125??C, allowing the device to perform reliably in demanding industrial environments where elevated temperatures are common.
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How does the ASM6-SR90-AHK0H handle electrostatic discharge?
This model is rated for ??4 kV according to the Human Body Model (HBM), providing robust protection against common electrostatic discharge events during handling and operation.
What package type is used for this device?
It is provided in a surface-mount device (SMD) package, supporting efficient PCB assembly and compatibility with automated soldering processes.
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What is the typical input signal frequency range supported?
The device supports input frequencies up to 90 kHz, making it suitable for applications that require fast response and accurate signal processing.
Is the power dissipation of this product suitable for compact system designs?
Yes, with a maximum power dissipation of 1.2 W, it offers low thermal output, reducing the need for extensive cooling solutions and enabling integration into compact electronic systems.