88W8887-A2-NNWA/AZ Wi-Fi 6E Tri-Band Module | Embedded Package

  • The 88W8887-A2-NNWA/AZ provides wireless connectivity, enabling seamless device communication in embedded systems.
  • It supports high-speed data transfer, essential for maintaining efficient network performance in demanding environments.
  • The compact LFCSP package reduces board space, allowing integration into size-constrained applications.
  • Ideal for IoT devices, this model ensures stable connections that enhance remote monitoring and control capabilities.
  • Designed for consistent operation, it meets rigorous quality standards to ensure long-term reliability in various conditions.
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88W8887-A2-NNWA/AZ Overview

The 88W8887-A2-NNWA/AZ is a highly integrated, low-power Wi-Fi 6 (802.11ax) and Bluetooth 5.2 combo wireless SoC designed to deliver advanced connectivity solutions for modern embedded applications. This device supports dual-band 2.4 GHz and 5 GHz operations, offering high throughput and enhanced spectral efficiency for demanding industrial and consumer environments. With optimized RF performance, integrated security features, and flexible interface options, it caters to engineers and sourcing specialists seeking reliable wireless communication modules. The device is ideal for applications requiring robust, low-latency wireless links and efficient power management. For more on advanced semiconductor solutions, visit 集成电路制造商.

88W8887-A2-NNWA/AZ Technical Specifications

参数 规格
Wireless Standards IEEE 802.11ax (Wi-Fi 6), Bluetooth 5.2
Frequency Bands 2.4 GHz and 5 GHz dual-band operation
Maximum Data Rate Up to 1.2 Gbps (Wi-Fi)
Modulation 1024-QAM (Wi-Fi 6)
Transmit Power Up to +20 dBm (typical)
安全功能 WPA3, Enhanced Open, Secure Boot
Interfaces SDIO 3.0, USB 2.0, UART, PCM
工作电压 3.3 V ?? 10%
包装类型 7×7 mm QFN, 48-pin
工作温度范围 -40°C 至 +85°C

88W8887-A2-NNWA/AZ Key Features

  • Dual-Band Wi-Fi 6 Support: Enables simultaneous 2.4 GHz and 5 GHz operation for improved network capacity and reduced interference, enhancing user experience in congested RF environments.
  • Bluetooth 5.2 Integration: Provides reliable and low-latency Bluetooth connectivity, supporting advanced audio and IoT device applications with improved power efficiency.
  • Advanced Security Mechanisms: Incorporates WPA3 encryption and secure boot to safeguard data integrity and prevent unauthorized access, critical in industrial and consumer deployments.
  • High-Performance RF Front-End: Delivers up to +20 dBm transmit power and supports 1024-QAM modulation, boosting throughput and range for demanding wireless communication needs.
  • Flexible Interface Compatibility: Supports multiple host interfaces such as SDIO 3.0, USB 2.0, UART, and PCM, simplifying integration into diverse system architectures.
  • 低功耗: Designed with power-efficient circuitry ideal for battery-powered devices, reducing operational costs and enhancing product lifespan.
  • 坚固的工作温度范围: Suitable for industrial environments, with reliable performance between -40??C and +85??C.

88W8887-A2-NNWA/AZ Advantages vs Typical Alternatives

This device offers superior wireless integration by combining Wi-Fi 6 and Bluetooth 5.2 into a single low-power SoC, reducing component count and system complexity. It provides higher data rates with enhanced spectral efficiency compared to legacy Wi-Fi modules, while its comprehensive security features outmatch many typical alternatives. Its broad interface support and industrial-grade temperature tolerance further elevate its suitability for demanding embedded applications.

典型应用

  • Embedded IoT Devices: Ideal for smart home controllers, industrial sensors, and connected appliances requiring dual-band Wi-Fi and Bluetooth connectivity with low power consumption and robust security.
  • Wireless Audio Equipment: Supports high-quality Bluetooth audio streaming and Wi-Fi-based media sharing with minimal latency and interference.
  • Industrial Automation: Enables reliable wireless communication in harsh environments through extended temperature range and secure protocols.
  • Consumer Electronics: Suitable for smart TVs, set-top boxes, and gaming peripherals that demand high throughput and seamless wireless connectivity.

88W8887-A2-NNWA/AZ Brand Info

This wireless combo SoC is developed by a leading semiconductor manufacturer specializing in high-performance connectivity solutions. The product is engineered to meet the stringent requirements of modern wireless applications, delivering industry-standard compliance alongside innovative features. Designed with a focus on integration, power efficiency, and security, it supports a broad ecosystem of hardware and software platforms, enabling faster time-to-market and reducing total system cost for original equipment manufacturers.

常见问题

What wireless standards does this device support?

The device supports the latest IEEE 802.11ax Wi-Fi 6 standard for high-speed wireless connectivity and Bluetooth 5.2 for advanced short-range communication. This combination ensures compatibility with contemporary wireless networks and devices.

What are the operating frequency bands for this wireless module?

It operates on dual frequency bands, specifically 2.4 GHz and 5 GHz. This dual-band functionality helps reduce interference and improves overall wireless performance in dense RF environments.

How does the device ensure security in wireless communications?

Security is enhanced through support for WPA3 encryption protocols, secure boot mechanisms, and advanced authentication features. These safeguards protect against unauthorized access and ensure data integrity during wireless transmissions.

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Which host interfaces are available for integrating this chip into systems?

The device offers multiple interfaces including SDIO 3.0, USB 2.0, UART, and PCM, allowing flexible integration with a wide range of host processors and system architectures commonly used in embedded designs.

What temperature range can this device reliably operate within?

It is designed for industrial use with an operating temperature range from -40??C up to +85??C, making it suitable for applications exposed to harsh environmental conditions.

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