STM32WB55RGV7 Overview
The STM32WB55RGV7 is a dual-core wireless microcontroller designed for advanced industrial and consumer applications requiring robust connectivity and low power consumption. Featuring an Arm? Cortex?-M4 core operating up to 64 MHz alongside a Cortex-M0+ core dedicated to radio protocol management, it provides optimized performance for Bluetooth? 5.0 and IEEE 802.15.4 standards. This device integrates up to 1 MB of Flash memory with 256 KB of RAM, enabling complex application development and enhanced data handling. Its extensive peripheral set and advanced security features make the STM32WB55RGV7 ideal for smart devices, IoT nodes, and industrial automation. Learn more at IC Manufacturer.
STM32WB55RGV7 Technical Specifications
Parameter | Specification |
---|---|
Core 1 | Arm Cortex-M4, up to 64 MHz |
Core 2 | Arm Cortex-M0+ dedicated to radio protocol |
Flash Memory | 1 MB |
RAM | 256 KB |
Wireless Connectivity | Bluetooth 5.0, IEEE 802.15.4 (Thread, ZigBee) |
Operating Voltage | 1.7 V to 3.6 V |
Package | RGV7: 73-pin LQFP |
Security Features | Hardware cryptographic accelerators, secure boot, true RNG |
Temperature Range | -40??C to +85??C |
STM32WB55RGV7 Key Features
- Dual-core architecture: Separates application processing and radio protocol tasks, ensuring efficient real-time wireless communication without compromising application performance.
- Advanced wireless support: Bluetooth 5.0 and IEEE 802.15.4 compatibility allow versatile connectivity options for IoT and smart device applications.
- Integrated security: On-chip cryptographic accelerators and secure boot features enhance data protection and device integrity against cyber threats.
- Low power consumption: Designed for energy-sensitive applications, supports various low-power modes extending battery life in portable and battery-operated devices.
Typical Applications
- Smart home and building automation devices leveraging Bluetooth 5.0 and ZigBee for reliable wireless control and monitoring.
- Industrial IoT sensors requiring robust wireless communication with long battery life and secure data transmission.
- Wearable health and fitness devices that benefit from low power operation and advanced connectivity features.
- Asset tracking and remote monitoring systems that demand real-time wireless communication and strong security.
STM32WB55RGV7 Advantages vs Typical Alternatives
This microcontroller combines a dual-core architecture with integrated Bluetooth 5.0 and IEEE 802.15.4 wireless protocols, offering superior flexibility and performance compared to single-core or single-protocol devices. Its hardware security features and low power consumption provide enhanced reliability and energy efficiency, making it a competitive choice for demanding wireless applications where integration, responsiveness, and data protection are critical.
🔥 Best-Selling Products
Texas Instruments BQ24075 Linear Battery Charger IC – 5mm x 4mm QFN Package
Texas Instruments INA219 Current Sensor Module – SOIC Package, Precision Monitoring
Texas Instruments LM4041 Precision Voltage Reference – SOT-23 Package
Texas Instruments OPA2134 Audio Op Amp – Dual, High-Performance, SOIC-8 Package
STM32WB55RGV7 Brand Info
The STM32WB55RGV7 is part of the STM32WB series developed by STMicroelectronics, a global leader in semiconductor solutions. STMicroelectronics specializes in microcontrollers and wireless connectivity products, focusing on innovation, quality, and energy efficiency. The STM32WB lineup targets IoT and smart connectivity markets, offering integrated wireless protocols, advanced security, and flexible architectures to enable next-generation connected devices.
FAQ
What wireless protocols does the STM32WB55RGV7 support?
This microcontroller supports Bluetooth 5.0 and IEEE 802.15.4 standards, which include Thread and ZigBee protocols. These wireless options provide reliable short-range communication suitable for a wide range of IoT and smart device applications.
🌟 Featured Products
“Buy MAX9312ECJ+ Precision Voltage Comparator in DIP Package for Reliable Performance”
QCC-711-1-MQFN48C-TR-03-1 Bluetooth Audio SoC with MQFN48C Package
0339-671-TLM-E Model – High-Performance TLM-E Package for Enhanced Functionality
1-1415898-4 Connector Housing, Electrical Wire-to-Board, Receptacle, Packaged
How does the dual-core architecture benefit application development?
The Cortex-M4 core handles user applications with high performance, while the Cortex