IPQ-5332-0-MRQFN251-MT-03-0 Wireless Networking SoC, MRQFN251-MT Package

IPQ-5332-0-MRQFN251-MT-03-0 Overview

The IPQ-5332-0-MRQFN251-MT-03-0 is identified by a compact SKU that combines a numeric series code and a high-count MRQFN package designation. The code embeds a 5332 series identifier and a 251-pin MRQFN footprint. That combination points to a high-pin-count device intended for dense I/O and integration on space-constrained boards. For sourcing and reference, see IC Üreticisi for ordering details and original documentation.

IPQ-5332-0-MRQFN251-MT-03-0 Technical Specifications

Parametre	Değer
Full product code	IPQ-5332-0-MRQFN251-MT-03-0
Series numeric identifier	5332
Package type	MRQFN
Pin count	251
Variant index	0
Revision code	03
Revision numeric	3
Trailing suffix	0
SKU segments (hyphen-separated)	7
Characters in SKU string	36

IPQ-5332-0-MRQFN251-MT-03-0 Key Features

• High pin density: the 251-pin MRQFN package enables many I/O signals and power rails, reducing board-level component count.
• Compact package format: MRQFN footprint supports smaller PCB area compared with larger BGA or LGA alternatives, aiding space-constrained designs.
• Clear revision tracking: 03 revision code and trailing 0 variant support traceable BOM control and tighter revision management versus undocumented SKUs.
• SKU transparency: explicit series number 5332 and multi-segment code simplify procurement and cross-referencing in distributor databases.

Tipik Uygulamalar

• High-density networking modules where a high-count QFN package reduces PCB routing layers and supports many I/O lines for faster integration and fewer external components.
• Compact gateway or router assemblies requiring a 251-pin device to consolidate multi-rail power, multiple interfaces, and mixed-signal connections in a small footprint.
• Industrial network appliances that need revision-controlled SKUs for long-term maintenance, spare-part tracking, and consistent production revision lifecycle management.
• Embedded communication boards used in constrained enclosures where MRQFN packaging offers a better size-to-pin-count ratio than larger package families and simplifies thermal layout.

IPQ-5332-0-MRQFN251-MT-03-0 Advantages vs Typical Alternatives

The MRQFN251 package with a 251-pin count delivers more available I/O and power pins than typical QFN parts with less than 200 pins, enabling more direct connections and fewer intermediate multiplexers. Compared to larger BGA options, this part can offer a smaller assembled footprint and simpler inspection without BGA reflow risk. The explicit 5332 series and 03 revision coding also make procurement and revision control easier than ambiguous or single-segment SKUs.

IPQ-5332-0-MRQFN251-MT-03-0 Brand Info

The IPQ designation is associated with the IPQ family of networking SoCs from Qualcomm Technologies (formerly Qualcomm Atheros). The brand is known for supplying silicon for routing and wireless infrastructure. This SKU naming follows established Qualcomm packaging and revision conventions, aiding engineers and sourcing teams in cross-reference and lifecycle planning.

SSS

What does MRQFN251 mean?

MRQFN251 denotes a micro QFN-style package that contains 251 pins. The label clarifies package type and pin count so designers can prepare pad layouts and thermal vias accurately for assembly.

What does the “5332” series indicate?

The numeric 5332 segment identifies the device series inside the full SKU. That series code helps match the part to datasheets, reference designs, and cross-reference tables from distributors.

How is the revision coded?

The SKU includes a 03 revision code and trailing 0 variant index. These numeric markers support BOM revision control and help sourcing teams order the correct production variant.

How should I prepare PCB land pattern?

Use the MRQFN package name and 251-pin count as the primary design inputs. Confirm pad dimensions, pin mapping, and thermal pad details from the official mechanical drawing before finalizing the land pattern.

Where can I get detailed datasheets?

Consult the original manufacturer’s datasheet and mechanical drawing available via authorized distributors or the manufacturer’s site. These documents provide pinout, electrical limits, thermal performance, and recommended soldering profiles.