BCM43692A1IFFBG Overview
The BCM43692A1IFFBG is a highly integrated wireless communication IC designed for advanced connectivity solutions. It delivers robust performance in dual-band Wi-Fi applications, supporting both 2.4 GHz and 5 GHz frequencies. This device integrates multiple cores, enabling efficient data processing and enhanced throughput, making it ideal for high-speed wireless networking in industrial and consumer electronics. With its compact form factor and support for multiple interfaces, the BCM43692A1IFFBG provides a reliable, scalable platform for OEMs and system designers. For further details and official documentation, visit the IC Üreticisi.
BCM43692A1IFFBG Technical Specifications
| Parametre | Şartname |
|---|---|
| Frequency Bands | 2.4 GHz and 5 GHz dual-band support |
| Wi-Fi Standards | 802.11ac Wave 2 |
| Çalışma Gerilimi | 1.2 V core voltage |
| Güç Tüketimi | Low power design optimized for mobile and embedded use |
| Arayüz Desteği | SDIO 3.0, PCIe, USB 3.0 |
| Antenna Configuration | 4×4 MIMO (Multiple Input Multiple Output) |
| Data Throughput | Up to 1.7 Gbps |
| Paket Tipi | Fine-pitch BGA (Ball Grid Array) |
| Sıcaklık Aralığı | -40??C to +85??C industrial grade |
BCM43692A1IFFBG Key Features
- Multi-core processing: Enables simultaneous handling of complex wireless protocols, improving throughput and reducing latency for critical industrial applications.
- Dual-band Wi-Fi support: Provides flexible connectivity options across 2.4 GHz and 5 GHz bands, ensuring better interference management and higher data rates.
- Advanced MIMO technology: The 4×4 MIMO antenna configuration enhances signal reliability and network capacity, essential for dense wireless environments.
- Düşük güç tüketimi: Designed to optimize energy efficiency, this IC extends battery life in portable devices and reduces thermal output in embedded systems.
- High-speed interface compatibility: Supports SDIO 3.0, PCIe, and USB 3.0 interfaces, facilitating seamless integration with various host controllers.
- Industrial temperature range: Operates reliably in harsh environments, supporting extended temperature ranges from -40??C to +85??C.
BCM43692A1IFFBG Advantages vs Typical Alternatives
This device offers superior integration by combining multi-core processing with dual-band Wi-Fi and 4×4 MIMO support, which enhances throughput and signal stability compared to typical single-core or single-band solutions. Its low power operation and industrial temperature tolerance make it more reliable and efficient in demanding environments. Additionally, broad interface compatibility simplifies system design and accelerates time to market, positioning it ahead of conventional wireless ICs.
🔥 En Çok Satan Ürünler
Tipik Uygulamalar
- High-performance wireless routers and access points requiring robust dual-band connectivity and increased data throughput for enterprise or industrial networks.
- Embedded wireless modules for IoT gateways that demand reliable multi-core processing and extended temperature range for outdoor or industrial use.
- Mobile computing devices and tablets benefiting from low power consumption and high-speed USB or PCIe interfaces.
- Smart home automation systems where stable, dual-band Wi-Fi connections and multi-antenna support improve device interoperability and user experience.
BCM43692A1IFFBG Brand Info
The BCM43692A1IFFBG is part of a series of advanced wireless communication ICs developed by a leading semiconductor manufacturer known for delivering cutting-edge connectivity solutions. This product leverages the company??s expertise in RF design and system integration, providing customers with a robust, scalable platform for next-generation wireless networking. Designed for versatility and high performance, it reflects the brand??s commitment to innovation, reliability, and industrial-grade quality in semiconductor components.
SSS
What wireless standards does this IC support?
This device supports the 802.11ac Wave 2 standard, enabling high-speed dual-band Wi-Fi connectivity. It accommodates both 2.4 GHz and 5 GHz frequency bands, which ensures compatibility with modern wireless networks and improved data throughput.
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Can this IC be used in industrial environments?
Yes, it is designed to operate within an industrial temperature range of -40??C to +85??C, making it suitable for harsh and demanding environments where temperature stability and reliability are critical.
What are the interface options available for this wireless IC?
The IC supports multiple high-speed interfaces including SDIO 3.0, PCIe, and USB 3.0. These options offer flexibility in system integration and enable easy connectivity with a variety of host processors and platforms.
📩 Bize Ulaşın
How does the multi-core architecture benefit performance?
Multi-core processing allows the device to handle multiple wireless protocols and data streams simultaneously. This improves throughput, reduces latency, and enhances overall network responsiveness, which is essential for applications requiring real-time data transfer.
What antenna configurations are supported by this IC?
The wireless IC supports a 4×4 MIMO antenna configuration. This advanced setup increases network capacity and signal reliability by transmitting and receiving multiple data streams simultaneously, improving performance in environments with high wireless traffic.
