BCM43570EKFFBG Overview
The BCM43570EKFFBG is a high-performance wireless connectivity solution designed for embedded applications requiring robust Wi-Fi and Bluetooth functionality. It integrates advanced radio and baseband components to deliver reliable dual-band 2.4 GHz and 5 GHz Wi-Fi support along with Bluetooth 5.0, catering to a wide range of industrial and consumer applications. The module supports IEEE 802.11ac Wave 2 standards, enabling high data throughput and low latency communication. Its compact form factor and integrated features provide design flexibility and simplified system integration, making it a preferred choice for engineers and sourcing specialists seeking a dependable semiconductor module from a trusted IC Üreticisi.
BCM43570EKFFBG Technical Specifications
| Parametre | Şartname |
|---|---|
| Wi-Fi Standards Supported | IEEE 802.11a/b/g/n/ac Wave 2 |
| Frequency Bands | 2.4 GHz and 5 GHz dual-band |
| Bluetooth Sürümü | Bluetooth 5.0 (BLE included) |
| Maximum Data Rate | Up to 867 Mbps (5 GHz) |
| Modulation Schemes | OFDM, DSSS, CCK, BPSK, QPSK, 16-QAM, 64-QAM |
| İletim Gücü | Up to 20 dBm (typical) |
| Arayüz | SDIO 3.0, UART, PCM |
| Çalışma Sıcaklık Aralığı | -40?? C ila +85?? C |
| Paket Tipi | Compact LGA (Land Grid Array) |
BCM43570EKFFBG Key Features
- Dual-band 802.11ac Wave 2 support: Enables high-speed wireless connections up to 867 Mbps, ensuring smooth data transfer and excellent network performance in congested environments.
- Bluetooth 5.0 integration: Offers enhanced range and throughput for Bluetooth Low Energy applications, improving device connectivity and energy efficiency.
- Advanced modulation techniques: Support for OFDM and multiple modulation schemes enhances signal robustness and spectral efficiency, critical for reliable communication in industrial settings.
- Compact LGA package: Facilitates easy PCB integration and space-saving designs, reducing overall system size without compromising performance.
BCM43570EKFFBG Advantages vs Typical Alternatives
This wireless module stands out due to its comprehensive dual-band Wi-Fi and Bluetooth 5.0 integration, which reduces the need for multiple discrete components, saving board space and simplifying design. Its support for 802.11ac Wave 2 technology offers higher throughput and better spectral efficiency compared to legacy solutions. Additionally, the wide operating temperature range and robust radio performance ensure reliable operation in demanding industrial environments, making it a superior choice for engineers prioritizing performance and integration.
🔥 En Çok Satan Ürünler
Tipik Uygulamalar
- Embedded industrial systems requiring reliable dual-band Wi-Fi and Bluetooth connectivity for data acquisition and remote monitoring, supporting robust wireless communication in harsh environments.
- Smart home devices where high-speed Wi-Fi and Bluetooth 5.0 enable seamless control and interoperability across multiple wireless protocols.
- IoT gateways that demand efficient wireless interfaces to connect various sensors and edge devices with cloud services.
- Wearable technology integrating Bluetooth Low Energy for extended battery life and Wi-Fi for high-data-rate applications.
BCM43570EKFFBG Brand Info
This module is part of a well-established semiconductor product line known for high-quality wireless communication solutions. Designed and manufactured by a leading IC Manufacturer, it benefits from extensive R&D focused on connectivity innovation and reliability. The product aligns with industry standards and is supported by comprehensive documentation and application resources to assist engineers in seamless integration and deployment.
SSS
What wireless standards does the BCM43570EKFFBG support?
The module supports IEEE 802.11a/b/g/n/ac Wave 2 for Wi-Fi connectivity, enabling dual-band operation in 2.4 GHz and 5 GHz frequencies. It also includes Bluetooth 5.0 with BLE support, providing versatile wireless communication options suitable for various industrial and consumer applications.
🌟 Öne Çıkan Ürünler
"Güvenilir Performans için DIP Paketinde MAX9312ECJ+ Hassas Voltaj Karşılaştırıcı Satın Alın"
QCC-711-1-MQFN48C-TR-03-1 Bluetooth Audio SoC with MQFN48C Package
0339-671-TLM-E Modeli - Gelişmiş İşlevsellik için Yüksek Performanslı TLM-E Paketi
1-1415898-4 Konektör Muhafazası, Elektrik Telinden Panoya, Priz, Paketli
What interfaces are available for integrating this module into a system?
Integration is facilitated through SDIO 3.0 for Wi-Fi data transfer, UART for control and debugging, and PCM for audio interfaces. These standard interfaces enable compatibility with a wide range of host processors and simplify system-level design.
What is the operating temperature range for this wireless module?
The device is designed to operate reliably within a temperature range from -40??C to +85??C. This wide range makes it suitable for industrial and outdoor applications where environmental conditions can vary significantly.
📩 Bize Ulaşın
How does the module improve wireless performance compared to older solutions?
By supporting 802.11ac Wave 2, it delivers higher throughput and better spectral efficiency than previous Wi-Fi standards. Additionally, the integration of advanced modulation schemes and Bluetooth 5.0 enhances communication range, speed, and reliability, which is critical in complex wireless environments.
Is this module suitable for compact embedded designs?
Yes, the compact Land Grid Array (LGA) package allows for efficient PCB layout and reduced footprint. This form factor helps system designers implement high-performance wireless connectivity in space-constrained applications without sacrificing functionality or reliability.
