88W8787-A16CBJ/AZ Wi-Fi 6 Chipset Module ?C High-Speed Wireless Network Package

  • This device provides advanced wireless connectivity, enabling efficient data transfer for embedded systems.
  • Featuring integrated Bluetooth and Wi-Fi support, it ensures versatile communication options for various applications.
  • The compact package reduces board space requirements, facilitating smaller and lighter electronic designs.
  • Ideal for IoT devices, the 88W8787-A16CBJ/AZ enhances seamless network access in smart home or industrial environments.
  • Engineered for durability, it maintains stable performance under diverse operating conditions to support long-term use.
NXP Semiconductors - логотип
产品上方询盘

88W8787-A16CBJ/AZ Overview

The 88W8787-A16CBJ/AZ is a high-performance integrated circuit designed for wireless communication applications. Engineered to deliver robust connectivity and efficient power management, it supports advanced data throughput with enhanced reliability. This device is optimized for seamless integration into compact systems requiring stable wireless interfaces and low power consumption. Suitable for a variety of industrial and commercial applications, the component offers a balance of sensitivity and processing capabilities to meet demanding engineering requirements. For detailed technical insights and procurement support, refer to Производитель ИС.

88W8787-A16CBJ/AZ Technical Specifications

Параметр Технические характеристики
Рабочее напряжение 1.8 V to 3.3 V
Тип упаковки 16-pin CSP (Chip Scale Package)
Диапазон рабочих температур -40??C до +85??C
Wireless Standard Support 802.11ac (Wi-Fi 5)
Data Throughput Up to 1.3 Gbps
Мощность передачи Up to +20 dBm
Чувствительность приемника -90 dBm at 54 Mbps
Интерфейс SDIO 3.0 / SPI

88W8787-A16CBJ/AZ Key Features

  • High-Speed Wireless Connectivity: Supports 802.11ac standard enabling data rates up to 1.3 Gbps, ensuring fast and reliable network performance for demanding applications.
  • Работа в режиме пониженного энергопотребления: Designed to operate efficiently within a 1.8 V to 3.3 V range, reducing overall system power consumption and extending device battery life.
  • Compact CSP Package: The 16-pin chip scale package allows for space-saving integration in compact electronic designs without compromising performance.
  • Широкий диапазон рабочих температур: Functional from -40??C to +85??C, making it suitable for industrial environments with extreme temperature variations.
  • Robust Receiver Sensitivity: Delivers -90 dBm sensitivity at 54 Mbps, enhancing signal reception in environments with considerable interference or weak signals.
  • Flexible Interface Options: Compatible with SDIO 3.0 and SPI interfaces, facilitating easy integration with various host controllers and embedded systems.
  • Reliable Transmit Power: Supports transmit power up to +20 dBm, providing strong wireless signal transmission to maintain stable connections in complex network topologies.

88W8787-A16CBJ/AZ Advantages vs Typical Alternatives

This device stands out due to its combination of high data throughput, low power consumption, and compact form factor. Compared to typical alternatives, it offers superior receiver sensitivity and flexible interface support, enhancing integration in diverse wireless applications. The wide operating temperature range and robust transmit power ensure dependable performance in challenging industrial environments, making it a preferred choice for engineers seeking reliable and efficient wireless solutions.

Типовые применения

  • Embedded wireless communication modules in industrial automation systems requiring reliable high-speed data transfer at low power.
  • IoT devices that demand compact size and energy efficiency for extended field operation.
  • Consumer electronics such as smart home appliances needing seamless Wi-Fi connectivity.
  • Wireless networking components in automotive telematics systems operating under varying temperature conditions.

88W8787-A16CBJ/AZ Brand Info

The 88W8787-A16CBJ/AZ is part of a comprehensive portfolio of wireless communication ICs offered by a leading semiconductor manufacturer known for delivering high-quality silicon solutions. This product exemplifies the brand??s commitment to innovation, reliability, and performance in wireless connectivity technology. Engineered to meet stringent industrial standards, the device supports the evolving needs of modern communication architectures and facilitates accelerated development cycles for OEMs and system integrators.

ЧАСТО ЗАДАВАЕМЫЕ ВОПРОСЫ

What wireless standards does this device support?

This product supports the 802.11ac wireless standard, commonly known as Wi-Fi 5, providing high-speed data transfer capabilities suitable for modern wireless communication designs.

What are the power requirements for operating this integrated circuit?

It operates within a voltage range of 1.8 V to 3.3 V, allowing compatibility with a wide range of power supply configurations while optimizing power efficiency.

Can the device function in harsh environmental conditions?

Yes, the device is rated for an operating temperature range from -40??C to +85??C, making it suitable for use in demanding industrial and automotive environments.

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产品中间询盘

What are the interface options available for system integration?

The unit supports both SDIO 3.0 and SPI interfaces, offering flexible connectivity options for easy integration with various host processors and embedded systems.

How does the receiver sensitivity impact wireless performance?

With a receiver sensitivity of -90 dBm at 54 Mbps, this component can detect weak signals effectively, improving communication reliability in environments with significant interference or extended range requirements.

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