88W8787-A1-BKBE/AZ Wireless Connectivity Module – Compact Embedded Package

88W8787-A1-BKBE/AZ Overview

The 88W8787-A1-BKBE/AZ is a high-performance integrated circuit designed to deliver robust wireless connectivity in demanding industrial and consumer applications. Engineered with advanced semiconductor process technology, it provides reliable data throughput and enhanced signal integrity for modern communication systems. Its compact form factor and power-efficient operation make it ideal for embedded wireless modules requiring consistent performance and low power consumption. This device effectively supports multiple wireless protocols, ensuring broad compatibility and seamless integration into complex electronic systems. For detailed technical and application insights, visit Производитель ИС.

88W8787-A1-BKBE/AZ Technical Specifications

Параметр	Технические характеристики
Технологические процессы	Advanced CMOS semiconductor process
Рабочее напряжение	1.8 V to 3.3 V
Диапазон рабочих температур	-40??C до +85??C
Wireless Protocol Support	Multi-standard (including IEEE 802.11 variants)
Потребляемая мощность	Low power, optimized for battery-powered devices
Тип упаковки	Compact Ball Grid Array (BGA)
Data Throughput	Up to several hundred Mbps depending on configuration
Interface Compatibility	Standard SPI, UART, and SDIO interfaces

88W8787-A1-BKBE/AZ Key Features

• High-speed wireless connectivity: Enables fast data transmission, supporting demanding communication needs in industrial and IoT applications.
• Multi-protocol support: Ensures compatibility across various wireless standards, simplifying system integration and reducing development time.
• Низкое энергопотребление: Designed for energy efficiency, extending battery life in portable and embedded devices.
• Надежный диапазон рабочих температур: Maintains reliable performance in harsh industrial environments, critical for mission-critical applications.
• Compact BGA packaging: Saves PCB space and supports high-density board designs, aiding miniaturization efforts.
• Flexible interface options: Offers multiple communication interfaces for easy integration with diverse host processors and peripherals.
• Enhanced signal integrity: Provides stable wireless connections, reducing data loss and improving overall system reliability.

88W8787-A1-BKBE/AZ Advantages vs Typical Alternatives

This device offers superior integration by combining multiple wireless protocol support within a single compact package, reducing the need for additional components. Its low power consumption and wide operating temperature range enhance reliability and efficiency compared to many alternatives. The flexible interface options simplify system design and improve compatibility, while its robust data throughput ensures high-performance wireless communication in industrial and embedded environments.

Типовые применения

• Embedded wireless modules for industrial automation systems requiring stable and fast data communication over multiple protocols.
• IoT devices that demand low power operation and reliable wireless connectivity in constrained spaces.
• Consumer electronics with integrated wireless features, benefiting from compact packaging and efficient power usage.
• Networking equipment that requires multi-standard wireless support and high data throughput for seamless connectivity.

88W8787-A1-BKBE/AZ Brand Info

Produced by a leading semiconductor manufacturer, this integrated circuit exemplifies cutting-edge wireless technology with a focus on reliability and integration efficiency. The 88W8787-A1-BKBE/AZ reflects the brand??s commitment to delivering high-quality, scalable solutions for complex wireless communication challenges. It supports a broad range of applications and provides designers with a versatile platform to develop next-generation wireless-enabled products.

ЧАСТО ЗАДАВАЕМЫЕ ВОПРОСЫ

What wireless standards does the 88W8787-A1-BKBE/AZ support?

This device supports multiple wireless protocols, including variants of IEEE 802.11 standards, enabling it to function across diverse wireless communication environments. This multi-protocol capability allows easy integration into systems requiring flexible connectivity options.

What is the typical power consumption of this IC?

The integrated circuit is optimized for low power usage, making it suitable for battery-operated and embedded devices. Its efficient design helps extend operational lifetime without compromising performance, especially important in portable and remote applications.

Can the device operate in harsh environmental conditions?

Yes, the device is rated for operation across a wide temperature range from -40??C to +85??C. This makes it suitable for industrial and outdoor applications where temperature extremes are common, ensuring consistent functionality.

What interface options are available for integration?

The IC supports standard communication interfaces such as SPI, UART, and SDIO. These options provide flexible connectivity to various host controllers and peripherals, simplifying system design and enhancing compatibility.

How does the packaging affect system design?

The compact Ball Grid Array (BGA) package reduces the overall footprint on the PCB, allowing for higher component density and smaller device sizes. This packaging also improves thermal performance and mechanical stability, important factors in industrial-grade electronics.