QCC-3091-0-WLNSP99-SR-06-0 Overview
The QCC-3091-0-WLNSP99-SR-06-0 is a compact wireless audio system-on-chip aimed at TWS earbuds and low-power headset designs. Its part string shows a WLCSP-99 package and a specific assembly revision, which help designers compare integration density, BOM count and board area versus larger-package alternatives. The device targets low standby current and integrated audio processing to reduce external components and accelerate time-to-market. For sourcing and datasheet access visit Fabricante de CI.
QCC-3091-0-WLNSP99-SR-06-0 Technical Specifications
| Parâmetro | Valor |
|---|---|
| Part number | QCC-3091-0-WLNSP99-SR-06-0 |
| Package type | WLCSP-99 |
| Package ball count | 99 |
| Revision code | SR-06 |
| Primary application | Wireless audio SoC for earbud/headset designs |
| Mounting style | Surface mount |
| Typical board area | Significantly smaller than 100-pin QFN alternatives |
| Integration level | High ?? on-chip audio DSP and RF subsystems |
| Target power profile | Low-power standby and active audio modes |
| Shipping identifier | 06 (reel / assembly variant) |
QCC-3091-0-WLNSP99-SR-06-0 Key Features
- High integration ?? Combines RF, audio DSP and power management to reduce external IC count and lower BOM cost.
- Compact WLCSP package ?? WLCSP-99 enables smaller PCB footprint compared with typical 48?C100 pin QFN packages, aiding ultra-compact earbud designs.
- Low-power operation ?? Optimized for reduced standby and run-time consumption to extend single-cell battery life in portable devices.
- Application-ready peripherals ?? Integrated audio and control interfaces accelerate reference designs and shorten firmware bring-up cycles.
QCC-3091-0-WLNSP99-SR-06-0 Advantages vs Typical Alternatives
The WLCSP-99 format and on-chip audio DSP deliver denser integration and a smaller PCB footprint compared with many QFN or LGA alternatives. Designers gain fewer external components, lower BOM count and faster mechanical integration. For space-constrained TWS designs, this part offers a more compact solution while retaining comparable audio processing capability.
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Aplicações típicas
- True wireless stereo (TWS) earbuds and mono Bluetooth buds where reduced board area and fewer external components shorten mechanical and acoustic design cycles by weeks.
- Bluetooth headsets and neckband-style devices that require integrated audio processing and small package size to balance comfort and battery life over typical use sessions.
- Portable audio accessory modules for OEM designs that need a high-integration SoC to minimize BOM cost and simplify antenna and power supply layout.
- Reference and development platforms for audio manufacturers evaluating package trade-offs between WLCSP-99 and larger-package ICs for mass production.
QCC-3091-0-WLNSP99-SR-06-0 Brand Info
Brand: Qualcomm Technologies, Inc. The QCC-3091-0-WLNSP99-SR-06-0 aligns with the Qualcomm QCC audio SoC family voice: focused on integration, low-power audio performance and fast time-to-market for consumer wireless products.
FAQ
What package does this part use?
The device uses a WLCSP-99 package as indicated by the WLNSP99 suffix. That WLCSP-99 format reduces PCB footprint and is suited to compact earbud assemblies and dense board layouts.
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Is this revision indicated in the part string?
Yes. The SR-06 segment denotes a specific assembly or shipping revision. Use that code to match BOM, reel coding and production assembly details with your supplier documentation.
What are the primary integration benefits?
The part combines RF, audio DSP and power management functions on-chip. That high integration lowers external component count, simplifies supply chain and reduces layout complexity for faster prototypes.
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Which applications suit this device?
It is best for TWS earbuds, mono Bluetooth headsets, and OEM audio modules where small size, low power and integrated audio processing shorten development time and reduce device weight.
Where can I obtain datasheets or samples?
Contact the authorized distributor or the manufacturer’s sales channel. Use the full part number and revision code when requesting datasheets, samples, or qualification-pack files to ensure correct assembly and test documentation.