QCA-6426-0-118NSP-TR-01-0 Wi-Fi/Bluetooth Combo IC Tape and Reel

QCA-6426-0-118NSP-TR-01-0 Overview

This component is a board-level semiconductor device offered in a factory-prepared shipping format. It is intended for engineers and sourcing specialists who need a compact, assembly-ready part for automated production and procurement. Documentation and packaging formats are designed to support standard pick-and-place processes and inventory control. For further manufacturer and ordering details consult Fabricante de CI

QCA-6426-0-118NSP-TR-01-0 Technical Specifications

Part Number	QCA-6426-0-118NSP-TR-01-0
Device Type	Semiconductor component intended for board-level installation
Tipo de embalagem	Surface-mount compatible package suitable for automated assembly
Packaging Method	Factory-ready packaging to support supply chain handling and automated placement
Mounting Style	SMD / surface-mount for standard printed circuit board assembly
Conformidade	Manufacturing and distribution practices aligned with industry environmental and safety guidelines
Storage and Handling	Packaged to mitigate moisture and handling damage during distribution and automated processing
Documentation	Datasheet, packaging, and ordering details available from supplier resources
Typical Use	Integration into electronic assemblies where component-level procurement and automated placement are required
Ordering Unit	Supplied in quantity units optimized for production and inventory management

QCA-6426-0-118NSP-TR-01-0 Key Features

• Compact, surface-mount package for efficient board-level integration, reducing board space and easing layout constraints.
• Factory-oriented packaging that supports automated pick-and-place processes, improving manufacturing throughput and yield.
• Documentation and format aimed at standard supply-chain workflows, facilitating procurement and inventory traceability.
• Designed for compatibility with common PCB assembly lines, lowering qualification time for production and enabling predictable assembly performance.

QCA-6426-0-118NSP-TR-01-0 Advantages vs Typical Alternatives

This part offers a production-ready form factor that simplifies sourcing and assembly. Compared with bulk or non-standard packaged alternatives, it reduces handling steps and helps maintain consistent placement and orientation during automated assembly. The packaging and documentation approach also support supplier traceability and efficient stock management, which is valuable for engineering and procurement teams.

Aplicações típicas

• Integration into industrial control boards where a surface-mount semiconductor part is required for reliable automated assembly and consistent placement accuracy across production runs.
• Sourcing for high-volume electronics manufacturing where standardized packaging and documentation reduce procurement complexity and support JIT inventory practices.
• Replacement or upgrade programs in legacy systems that require board-level compatible parts with controlled packaging to match existing assembly processes and quality procedures.
• Prototyping and pilot production phases where engineering teams need a component delivered in a format that mirrors expected mass-production packaging and handling.

QCA-6426-0-118NSP-TR-01-0 Brand Info

FAQ

How is this part packaged?

The part is supplied in a factory-prepared packaging format intended for automated handling. Packaging is optimized to protect the component during shipping and to support pick-and-place equipment. Refer to supplier packing documentation for exact carrier and tape configurations before production planning.

Where can I find the datasheet?

Datasheet and technical documents are provided by the authorized distributor or the component supplier. Consult the supplier resource portal or your authorized distributor to obtain the full datasheet, mechanical drawings, and recommended land pattern.

Is this component suitable for surface-mount assembly?

Yes. The device is presented in a surface-mount compatible package and is intended for board-level SMD assembly. Verify recommended soldering profiles and PCB footprint details in the supplier documentation to ensure correct assembly and reflow results.

What procurement information should I verify?

Confirm ordering codes, minimum order quantities, packaging format, lead times, and any lot traceability or date code requirements with your supplier. Check for available compliance and qualification documentation to meet your internal sourcing policies.

How do I handle storage and moisture sensitivity?

Follow supplier guidance for storage and handling to avoid moisture-related issues common to surface-mount components. Use recommended dry storage and observe any floor-life and baking instructions provided in the packing documentation prior to assembly.