QCA-6426-0-118NSP-MT-01-0 Wi-Fi SoC NSP-MT package

QCA-6426-0-118NSP-MT-01-0 Overview

The QCA-6426-0-118NSP-MT-01-0 is presented as a precision semiconductor component intended for professional engineering and sourcing workflows. The product sheet frames it for board-level integration with a focus on compact packaging, multi-interface connectivity, and suitability for industrial integration. Documentation emphasizes practical considerations for assembly, thermal management, and regulatory compliance that matter to design and procurement teams. For sourcing and supplier information visit Fabricante de CI

QCA-6426-0-118NSP-MT-01-0 Technical Specifications

Part number	QCA-6426-0-118NSP-MT-01-0 as listed on the product sheet
Package type	Surface-mount compatible package described for PCB assembly
Mounting	Designed for automated placement and reflow solder processes
Primary function	Semiconductor device intended for integration within electronic subsystems
I/O interfaces	Multiple digital and control interfaces referenced for host integration
Power supply	Supply and decoupling recommendations provided in the product documentation
Thermal	Thermal handling guidance and footprint recommendations included for PCB design
Environmental rating	Industrial-oriented operating conditions and storage guidance are referenced
Conformidade	Regulatory and material compliance notes are included in the documentation
Lifecycle & packaging	Packaging options and ordering codes are presented in the product materials

QCA-6426-0-118NSP-MT-01-0 Key Features

• Compact package enables high density PCB layouts and simplifies placement in constrained board areas, reducing overall system footprint.
• Multi-interface support allows flexible host connectivity options, easing integration into different controller and system topologies.
• Assembly-friendly design with surface-mount compatibility and reflow guidance to streamline manufacturing and improve yield.
• Documented reliability considerations that support long-term operation in industrial applications through recommended thermal and layout practices.

QCA-6426-0-118NSP-MT-01-0 Advantages vs Typical Alternatives

This device is positioned with a focus on practical integration and manufacturability. Compared with generic alternatives, it emphasizes surface-mount readiness, clear assembly guidance, and documented environmental handling, making it easier for engineering teams to move from prototype to production with predictable board-level behavior and procurement transparency.

Aplicações típicas

• Embedded control modules where compact semiconductor devices are required for dense board designs and consistent manufacturability across production runs.
• Industrial automation equipment that benefits from documented thermal and assembly practices to support reliable field operation under sustained use.
• Communication and gateway modules that need flexible interface options to connect with a variety of host processors and peripheral subsystems.
• Evaluation and prototyping platforms used by development teams to validate board-level integration, thermal behavior, and assembly processes before scale-up.

QCA-6426-0-118NSP-MT-01-0 Brand Info

FAQ

What packaging and PCB footprint guidance is provided for this part?

The product sheet includes packaging and footprint guidance intended to support PCB layout and automated assembly. Designers should follow the recommended land pattern, solder mask openings, and thermal pad details to achieve consistent solder joints and thermal performance during reflow processes.

How should this device be powered and decoupled on the board?

Powering and decoupling recommendations appear in the documentation to ensure stable operation. Typical guidance covers placement of local decoupling capacitors, routing strategies for power and ground, and recommended power sequencing where applicable to prevent board-level disturbances.

What environmental and thermal considerations should engineers plan for?

Thermal guidance in the product materials addresses heat dissipation and PCB thermal relief. Engineers should consider placement relative to other heat sources, use of thermal vias if suggested, and adherence to the recommended operating environment to maintain reliable performance.

Where can I obtain ordering, lifecycle, and packaging details?

Ordering and lifecycle information is provided in the product documentation and through authorized supply channels. For volume pricing, lead times, and packaging form factors, consult the distributor or the referenced manufacturer resources linked in the datasheet.

What compliance and test data are available for qualification purposes?

The datasheet references material compliance and regulatory notes relevant to sourcing and qualification workflows. For formal qualification data, reliability reports, or additional testing information, request the relevant qualification pack or contact the supplier channel listed in the product documentation.