XCZU4CG-1SFVC784E Overview
The XCZU4CG-1SFVC784E is a versatile and powerful System on Chip (SoC) designed for a range of industrial applications. It combines high-performance processing capabilities with advanced programmable logic, making it ideal for complex tasks in real-time systems. This device supports various communication protocols, enhancing connectivity and integration in diverse environments. Its robust architecture ensures reliability and efficiency, catering to the needs of engineers and sourcing specialists alike. For more comprehensive details, visit IC Manufacturer.
XCZU4CG-1SFVC784E Key Features
- High-performance processing: The SoC features multiple processing units, allowing for efficient handling of demanding applications and reducing latency in data processing.
- Flexible programmable logic: Users can leverage the programmable logic to customize hardware acceleration, enabling tailored solutions for specific industrial requirements.
- Enhanced connectivity options: With support for various communication standards, the device ensures seamless integration with existing systems and peripherals, facilitating easier deployment.
- Robust architecture: Designed for reliability, the XCZU4CG-1SFVC784E can withstand harsh industrial environments, making it suitable for long-term use.
XCZU4CG-1SFVC784E Technical Specifications
| Parameter | Details |
|---|---|
| Core Type | Dual-core ARM Cortex-A53 |
| Logic Cells | Approximately 4,000 |
| Memory | 1 GB DDR4 |
| Package Type | 784 BGA |
| Operating Temperature | -40??C to +100??C |
| Power Supply Voltage | 1.0V to 1.2V |
| Communication Interfaces | USB, I2C, SPI, UART |
| Dimensions | 27 mm x 27 mm |
XCZU4CG-1SFVC784E Advantages vs Typical Alternatives
The XCZU4CG-1SFVC784E stands out among typical alternatives due to its combination of high processing power and flexible programmability. This SoC offers better integration capabilities, allowing engineers to customize solutions for specific applications, while maintaining reliability and efficiency in demanding environments.
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Typical Applications
- Industrial automation: The XCZU4CG-1SFVC784E is well-suited for robotics and control systems, enabling real-time data processing and response.
- Embedded vision systems: Its processing power supports advanced image processing algorithms, enhancing capabilities in machine vision applications.
- Telecommunications: The device’s robust communication interfaces facilitate seamless connectivity in network equipment.
- Medical devices: With its reliable performance, it is ideal for use in diagnostic equipment and monitoring systems.
XCZU4CG-1SFVC784E Brand Info
The XCZU4CG-1SFVC784E is a product from a leading manufacturer known for its innovative solutions in the semiconductor industry. This brand focuses on developing high-performance devices that cater to the evolving needs of various sectors, including industrial, automotive, and telecommunications. The XCZU4CG-1SFVC784E exemplifies the brand’s commitment to delivering reliable and efficient products that empower engineers to create advanced applications.
FAQ
What is the core architecture of the XCZU4CG-1SFVC784E?
The XCZU4CG-1SFVC784E features a dual-core ARM Cortex-A53 architecture, providing high-performance processing capabilities for complex tasks in real-time systems.
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What communication interfaces does this device support?
This device supports multiple communication protocols, including USB, I2C, SPI, and UART, ensuring compatibility with a wide range of peripherals and systems.
What are the key advantages of using XCZU4CG-1SFVC784E in industrial applications?
Its combination of high processing power, flexible programmability, and robust architecture makes it an excellent choice for demanding industrial applications, enhancing both reliability and efficiency.
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What is the operating temperature range for this device?
The XCZU4CG-1SFVC784E is designed to operate within a temperature range of -40??C to +100??C, making it suitable for harsh environments.
What is the size of the XCZU4CG-1SFVC784E package?
The device comes in a 784 BGA package, with dimensions of 27 mm x 27 mm, facilitating easy integration into compact designs.