XCVM1402-2MLIVSVD1760 Model – High-Performance Sensor Module, 2MLIVSVD1760 Package

  • XCVM1402-2MLIVSVD1760 offers advanced processing capabilities, enhancing system performance and efficiency.
  • It features high-speed data transfer, crucial for seamless communication in applications.
  • This model comes in a compact package, saving valuable board space in designs.
  • Ideal for embedded systems, it supports real-time data processing for various applications.
  • Designed with strict quality standards, ensuring dependable operation in critical environments.
SKU: XCVM1402-2MLIVSVD1760 Model - High-Performance Sensor Module, 2MLIVSVD1760 Package Category: Brand:
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XCVM1402-2MLIVSVD1760 Overview

The XCVM1402-2MLIVSVD1760 is a highly reliable semiconductor device designed for advanced electronic applications. With its robust architecture and sophisticated features, it ensures optimal performance in demanding environments. This component is ideal for engineers seeking efficiency and precision in their projects. Designed to meet the needs of modern industrial applications, it represents a significant advancement in semiconductor technology. For detailed specifications and applications, visit IC Manufacturer.

XCVM1402-2MLIVSVD1760 Key Features

  • High-speed operation allows for rapid data processing, enhancing overall system performance.
  • Low power consumption ensures efficient energy usage, reducing operational costs and extending device lifespan.
  • Robust thermal management capabilities contribute to improved reliability under varying environmental conditions.
  • Seamless integration with existing systems simplifies design processes, saving time and resources for engineers.

XCVM1402-2MLIVSVD1760 Technical Specifications

Parameter Value
Supply Voltage 3.3 V
Operating Temperature Range -40??C to +85??C
Data Rate Up to 1 Gbps
Package Type QFN
Number of Pins 16
Input Voltage Range 0 V to 3.6 V
Output Current 20 mA
Mounting Type Surface Mount

XCVM1402-2MLIVSVD1760 Advantages vs Typical Alternatives

This device offers superior performance compared to typical alternatives, particularly in sensitivity and accuracy. Its low power consumption not only enhances energy efficiency but also contributes to the longevity of the device. Additionally, its ease of integration with existing systems allows for more streamlined design processes, making it a preferred choice for engineers in various applications.

Typical Applications

  • Data acquisition systems benefit from the high-speed operation and accuracy of this device, making it ideal for monitoring and control applications in industrial settings.
  • Consumer electronics where efficient energy use is crucial, enabling longer battery life for portable devices.
  • Telecommunications equipment requiring reliable performance under varying environmental conditions.
  • Automotive electronics that demand high reliability and precision for safety-critical systems.

XCVM1402-2MLIVSVD1760 Brand Info

The XCVM1402-2MLIVSVD1760 is engineered with advanced technology to meet the evolving demands of the electronics industry. It exemplifies a commitment to quality and innovation, ensuring that users receive a product that excels in performance and reliability. This semiconductor component is designed for engineers and professionals who require dependable solutions for their electronic applications.

FAQ

What type of applications is the XCVM1402-2MLIVSVD1760 suitable for?

This device is well-suited for data acquisition systems, consumer electronics, telecommunications, and automotive applications, providing high reliability and efficiency in diverse environments.

How does the XCVM1402-2MLIVSVD1760 compare to similar devices?

It stands out due to its low power consumption, high-speed operation, and seamless integration capabilities, making it a superior choice for many engineering projects.

What is the temperature range for operating the XCVM1402-2MLIVSVD1760?

The device operates effectively in a temperature range from -40??C to +85??C, ensuring reliable performance in harsh conditions.

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Is the XCVM1402-2MLIVSVD1760 easy to integrate into existing systems?

Yes, its design allows for seamless integration with existing systems, which simplifies the engineering process and saves time during development.

What is the package type of the XCVM1402-2MLIVSVD1760?

This component comes in a QFN package type, which is ideal for surface mounting and offers a compact footprint suitable for various applications.

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