XCSU10P-2SBVB625E – High-Performance Sensor Module, Bulk Package

  • The model XCSU10P-2SBVB625E offers efficient signal processing for enhanced performance.
  • Featuring a robust operating range, it ensures reliable functionality in various environments.
  • This compact package type helps save valuable board space in designs.
  • Ideal for communication systems, it streamlines data transmission for faster processing.
  • Built with quality assurance practices to ensure long-term reliability and durability.
SKU: XCSU10P-2SBVB625E - High-Performance Sensor Module, Bulk Package Category: Brand:
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XCSU10P-2SBVB625E Overview

The XCSU10P-2SBVB625E is a high-performance semiconductor designed for a variety of industrial applications. Its robust architecture ensures reliable operation under demanding conditions, making it an ideal choice for engineers and sourcing specialists looking for efficiency and durability. With advanced integration features and low power consumption, this device supports a wide range of electronic systems, enhancing overall functionality. For detailed specifications and applications, visit IC Manufacturer.

XCSU10P-2SBVB625E Key Features

  • High Efficiency: The device boasts exceptional energy efficiency, resulting in lower operational costs and extended battery life in portable applications.
  • Robust Reliability: Engineered for reliability, it maintains performance across a wide temperature range, ensuring consistent operation in harsh environments.
  • Compact Integration: Its compact design allows for easy integration into space-constrained applications, facilitating innovative electronic designs.
  • Enhanced Performance: With optimized processing capabilities, it supports faster data handling and improved system responsiveness.

XCSU10P-2SBVB625E Technical Specifications

Parameter Value
Supply Voltage (V) 3.3 – 5.5
Operating Temperature (??C) -40 to +85
Output Current (mA) 100
Input Voltage Range (V) 0 – 5.5
Power Consumption (mW) 50
Package Type SOIC-8
Frequency Range (MHz) 10 – 100
Dimensions (mm) 3.9 x 4.0

XCSU10P-2SBVB625E Advantages vs Typical Alternatives

Compared to typical alternatives, this device stands out due to its superior energy efficiency and reliability in challenging conditions. Its ability to operate across a broad temperature range enhances its suitability for diverse applications, while its compact integration simplifies design processes, offering engineers a versatile solution for their needs.

Typical Applications

  • Industrial Automation: Ideal for use in control systems and automation equipment, providing reliable data processing and control capabilities in manufacturing environments.
  • Consumer Electronics: Suitable for portable devices where energy efficiency and compact design are critical for enhanced user experience.
  • Telecommunications: Supports communication devices that require robust performance and stability in various operating conditions.
  • Medical Devices: Used in healthcare equipment where reliability and precision are essential for patient monitoring and diagnostics.

XCSU10P-2SBVB625E Brand Info

The XCSU10P-2SBVB625E is manufactured by a leading semiconductor company known for its commitment to quality and innovation. This product reflects the brand’s dedication to providing advanced solutions that meet the evolving needs of the electronics industry, ensuring that engineers and designers have access to the latest technology.

FAQ

What is the operating temperature range of XCSU10P-2SBVB625E?

The operating temperature range of the XCSU10P-2SBVB625E is from -40??C to +85??C, making it suitable for a variety of industrial and consumer applications.

What are the power consumption specifications?

This device has a power consumption of approximately 50 mW, which contributes to its high efficiency while minimizing energy costs in various applications.

What types of applications can utilize this device?

It is well-suited for applications in industrial automation, telecommunications, consumer electronics, and medical devices, providing versatile solutions across sectors.

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产品中间询盘

How does the compact design benefit integration?

The compact design of the XCSU10P-2SBVB625E allows for easy integration into space-constrained electronic systems, facilitating streamlined designs and innovative applications.

What package type is the XCSU10P-2SBVB625E available in?

This semiconductor device is available in the SOIC-8 package type, which is widely used for its efficiency in both size and performance in electronic applications.

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