XCAU20P-1FFVB676I – High-Performance FPGA Module, 676-Pin Package

  • XCAU20P-1FFVB676I is designed for advanced processing tasks, enhancing system performance.
  • Features high-speed connectivity options, ensuring efficient data transfer and communication.
  • Compact package type allows for space-saving designs in various applications.
  • Ideal for embedded systems, facilitating real-time data processing in diverse environments.
  • Built with robust reliability standards, ensuring consistent operation and longevity.
SKU: XCAU20P-1FFVB676I - High-Performance FPGA Module, 676-Pin Package Category: Brand:
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产品上方询盘

XCAU20P-1FFVB676I Overview

The XCAU20P-1FFVB676I is a high-performance semiconductor device designed for advanced applications in industrial technology. With its robust architecture and efficient processing capabilities, it serves as a reliable choice for engineers and sourcing specialists. This component delivers enhanced integration features, making it ideal for complex electronic systems that require precision and efficiency. For detailed specifications and further information, please visit IC Manufacturer.

XCAU20P-1FFVB676I Key Features

  • High Performance: Delivers exceptional processing speed, allowing for rapid data handling essential in high-demand applications.
  • Energy Efficiency: Designed to minimize power consumption, which helps to reduce operational costs and increase system longevity.
  • Robust Reliability: Engineered to operate in challenging environments, ensuring dependable performance under various conditions.
  • Flexible Integration: Supports a wide range of interfaces, facilitating easy incorporation into existing systems, thus saving time and resources.

XCAU20P-1FFVB676I Technical Specifications

Parameter Description
Core Count Multi-core architecture for parallel processing.
Operating Voltage Supports a broad voltage range for versatile applications.
Process Technology Utilizes advanced fabrication processes for improved performance.
Package Type FFVB676 for efficient thermal management.
Maximum Operating Temperature Designed to function reliably at elevated temperatures.
Clock Speed Optimized for high-frequency operations.
Memory Support Compatible with various memory types enhancing functionality.
Interface Options Diverse interfaces for seamless integration.

XCAU20P-1FFVB676I Advantages vs Typical Alternatives

This device stands out in the market due to its superior energy efficiency and robust reliability, which often surpass typical alternatives. Its flexible integration capabilities allow for easy adaptation in various applications, making it a preferred choice for engineers seeking reliable components.

Typical Applications

  • Industrial Automation: Ideal for control systems in manufacturing environments, where precision and reliability are critical for operational efficiency and safety.
  • Telecommunications: Used in communication devices that require high processing capabilities for data transmission.
  • Automotive Systems: Suitable for advanced driver-assistance systems (ADAS) that demand quick response times and high reliability.
  • Consumer Electronics: Applied in high-performance gadgets where efficiency and speed are paramount.

XCAU20P-1FFVB676I Brand Info

The XCAU20P-1FFVB676I is produced by a leading manufacturer specializing in semiconductor solutions. The brand is recognized for its commitment to innovation and quality, providing engineers with high-performance components that meet the demands of modern applications. The product reflects the brand’s dedication to excellence and reliability in the electronics industry.

FAQ

What is the maximum operating temperature for the XCAU20P-1FFVB676I?

The maximum operating temperature for this device is designed to ensure reliable performance in high-temperature environments, making it suitable for various industrial applications.

How does the XCAU20P-1FFVB676I compare in energy efficiency?

This semiconductor device offers superior energy efficiency compared to typical alternatives, leading to reduced operational costs and a lower carbon footprint in applications.

What types of interfaces are supported?

The device supports a variety of interfaces, allowing for seamless integration into existing systems and enhancing its versatility in diverse applications.

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产品中间询盘

Can the XCAU20P-1FFVB676I be used in automotive applications?

Yes, it is suitable for automotive applications, particularly in advanced driver-assistance systems (ADAS), where reliability and performance are critical.

What are the benefits of its multi-core architecture?

The multi-core architecture allows for parallel processing, enhancing overall performance and enabling the device to handle complex tasks efficiently.

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