XCAU15P-1FFVB676E Overview
The XCAU15P-1FFVB676E is a high-performance device tailored for demanding industrial applications, offering a blend of advanced processing capabilities and robust reliability. With its integrated features, this product is designed to enhance operational efficiency while simplifying system design. The unique architecture ensures optimal performance in a variety of applications, making it a preferred choice for engineers and sourcing specialists alike. For more details, visit IC Manufacturer.
XCAU15P-1FFVB676E Key Features
- High processing performance enables rapid data handling, significantly improving system responsiveness.
- Robust integration capabilities allow seamless compatibility with existing systems, reducing development time and costs.
- Enhanced power efficiency translates to lower operational costs and reduced thermal output, ensuring reliability over extended periods.
- Advanced security features protect sensitive data, making it suitable for applications requiring stringent security measures.
XCAU15P-1FFVB676E Technical Specifications
| Parameter | Value |
|---|---|
| Core Count | 15 |
| Max Frequency | 1.2 GHz |
| RAM Support | Up to 8 GB |
| Process Technology | 28 nm |
| Power Consumption | 5 W |
| Operating Temperature Range | -40??C to +125??C |
| Package Type | FBGA |
| Dimensions | 676 balls |
XCAU15P-1FFVB676E Advantages vs Typical Alternatives
This device outperforms typical alternatives by offering superior processing power and energy efficiency. Its ability to integrate with various systems without compromise enhances flexibility, making it a reliable choice for engineers seeking performance and dependability.
🔥 Best-Selling Products
Typical Applications
- Industrial automation systems benefit from the device’s high processing power, enabling real-time data analytics and control in manufacturing environments, ensuring optimal productivity and efficiency.
- Embedded systems in automotive applications leverage the reliability and performance, enhancing vehicle safety features and connectivity.
- Telecommunication infrastructure can utilize the advanced capabilities for improved data transmission and network management.
- Medical devices requiring precise monitoring and control can rely on the robust architecture for critical health applications.
XCAU15P-1FFVB676E Brand Info
The XCAU15P-1FFVB676E is manufactured by a leading company in semiconductor technology, known for delivering innovative solutions that meet the evolving needs of various industries. This product exemplifies the brand’s commitment to quality, performance, and cutting-edge technology.
FAQ
What is the maximum frequency of the XCAU15P-1FFVB676E?
The device operates at a maximum frequency of 1.2 GHz, providing significant processing power for demanding applications.
🌟 Featured Products
-
“Buy MAX9312ECJ+ Precision Voltage Comparator in DIP Package for Reliable Performance”
-
QCC-711-1-MQFN48C-TR-03-1 Bluetooth Audio SoC with MQFN48C Package
-
0339-671-TLM-E Model – High-Performance TLM-E Package for Enhanced Functionality
-
1-1415898-4 Connector Housing, Electrical Wire-to-Board, Receptacle, Packaged
What kind of applications can benefit from this device?
This device is ideal for applications in industrial automation, automotive systems, telecommunications, and medical devices, where reliability and performance are crucial.
What temperature range can the XCAU15P-1FFVB676E operate in?
The device is designed to function effectively in a wide operating temperature range of -40??C to +125??C, making it suitable for harsh environments.
📩 Contact Us
How does the power consumption of this device compare to alternatives?
With a power consumption of just 5 W, it offers a significant advantage in energy efficiency compared to other devices in its class, reducing overall operational costs.
What packaging options are available for the XCAU15P-1FFVB676E?
The product is available in a FBGA package type, featuring 676 balls, which provides a compact form factor suitable for space-constrained applications.
