XC7Z045-2FBG676I FPGA – High-Performance Processing in BGA676 Package

  • The XC7Z045-2FBG676I offers high-performance processing for complex applications.
  • Features advanced processing capabilities, enabling efficient data handling in various tasks.
  • Compact footprint allows for efficient use of board space in designs.
  • Ideal for embedded systems, enhancing functionality in automation and control applications.
  • Designed with reliability in mind, ensuring consistent performance over time.
SKU: XC7Z045-2FBG676I FPGA - High-Performance Processing in BGA676 Package Category: Brand:
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产品上方询盘

XC7Z045-2FBG676I Overview

The XC7Z045-2FBG676I is a versatile System on Chip (SoC) designed for high-performance applications. With advanced integration capabilities, it combines FPGA flexibility and ARM processing power, making it ideal for industrial automation, medical devices, and automotive systems. This device delivers robust performance with an emphasis on efficiency, enabling engineers to create innovative solutions tailored to complex tasks. For detailed information, visit IC Manufacturer.

XC7Z045-2FBG676I Key Features

  • Dual-core ARM Cortex-A9: Provides high processing power, allowing for real-time data processing and multitasking in demanding applications.
  • Integrated FPGA Fabric: Enhances design flexibility, enabling rapid prototyping and custom hardware acceleration tailored to specific application requirements.
  • Low Power Consumption: Optimized for energy efficiency, this SoC reduces operational costs and extends device longevity in embedded systems.
  • Rich I/O Options: Supports a wide range of interfaces, including USB, Ethernet, and GPIO, facilitating easy integration into diverse system architectures.

XC7Z045-2FBG676I Technical Specifications

Parameter Value
Core Architecture ARM Cortex-A9 Dual-Core
FPGA Logic Cells Over 85,000
Operating Frequency Up to 1 GHz
Memory Support DDR3, DDR2
Package Type 676 FBGA
Thermal Management 0 to 100 ??C Operating Temperature
Power Supply Voltage 1.0V to 1.2V
Number of I/O Pins Up to 200

XC7Z045-2FBG676I Advantages vs Typical Alternatives

The XC7Z045-2FBG676I offers superior performance and power efficiency compared to typical alternatives. Its unique combination of FPGA integration and dual-core processing allows engineers to achieve higher accuracy and reliability in applications that require real-time processing.

Typical Applications

  • Industrial Automation: Utilized in robotics and control systems, providing real-time processing and flexible hardware configurations to enhance efficiency and productivity.
  • Medical Devices: Ideal for imaging systems and diagnostic tools, ensuring high performance and reliability in critical health applications.
  • Automotive Systems: Supports advanced driver-assistance systems (ADAS) with its processing capabilities and low power requirements.
  • Smart Cities: Drives applications in smart grid technologies and urban infrastructure, enabling efficient data management and connectivity.

XC7Z045-2FBG676I Brand Info

The XC7Z045-2FBG676I is part of a renowned family of products known for their robust design and exceptional performance. This brand focuses on delivering innovative solutions tailored for the industrial technology sector, ensuring that engineers and developers have access to high-quality components that meet the evolving needs of modern applications.

FAQ

What is the maximum operating frequency of the XC7Z045-2FBG676I?

The maximum operating frequency of the XC7Z045-2FBG676I is up to 1 GHz, allowing for efficient processing in various demanding applications.

What types of memory does the XC7Z045-2FBG676I support?

This device supports DDR3 and DDR2 memory, providing flexibility in memory configuration for different application needs.

How many I/O pins does the XC7Z045-2FBG676I have?

The XC7Z045-2FBG676I can support up to 200 I/O pins, which facilitates versatile integration into various system designs.

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产品中间询盘

What is the operating temperature range for this device?

The operating temperature range for the XC7Z045-2FBG676I is from 0 to 100 ??C, making it suitable for a wide range of environmental conditions.

What packaging type does the XC7Z045-2FBG676I come in?

The device is available in a 676 FBGA package, providing a compact and efficient solution for circuit board integration.

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