XC7Z030-2FFG676E FPGA Chip – High-Performance Package Type: FFG676

  • The XC7Z030-2FFG676E is designed for high-performance processing in embedded systems.
  • Featuring multiple processing cores, it enables efficient multitasking for complex applications.
  • This model comes in a compact package, saving valuable board space in designs.
  • Ideal for industrial automation, it enhances control systems for better operational efficiency.
  • Manufactured under strict quality standards, it ensures reliable performance in critical applications.
SKU: XC7Z030-2FFG676E FPGA Chip - High-Performance Package Type: FFG676 Category: Brand:
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产品上方询盘

XC7Z030-2FFG676E Overview

The XC7Z030-2FFG676E is a versatile System on Chip (SoC) that combines high-performance processing with advanced programmable logic. It is designed for applications requiring both flexibility and efficiency. With integrated ARM Cortex-A9 cores and FPGA capabilities, this device supports a wide range of industrial and commercial applications, making it a pivotal component for engineers and sourcing specialists. For comprehensive specifications and detailed insights, visit IC Manufacturer.

XC7Z030-2FFG676E Key Features

  • Dual-core ARM Cortex-A9: Provides robust processing power for demanding applications, allowing for faster data processing and enhanced multitasking capabilities.
  • Integrated FPGA Fabric: Offers customizable logic for specific application needs, enabling engineers to tailor solutions without the need for additional hardware.
  • Low Power Consumption: Designed for energy efficiency, helping to reduce operational costs while maintaining high performance.
  • High-Speed Connectivity: Supports various interfaces, ensuring seamless communication with other devices and peripherals, crucial for complex system integration.

XC7Z030-2FFG676E Technical Specifications

Parameter Value
Core Architecture ARM Cortex-A9 Dual-Core
FPGA Logic Cells 28k
Operating Frequency Up to 1 GHz
RAM 512 MB
Flash Memory Up to 256 MB
Power Supply Voltage 1.0 V to 1.2 V
Package Type 676-FBGA
Temperature Range -40??C to +100??C

XC7Z030-2FFG676E Advantages vs Typical Alternatives

The XC7Z030-2FFG676E stands out against typical alternatives due to its combination of processing power and flexibility. Its dual-core architecture enhances performance while the integrated FPGA fabric allows for custom logic solutions, reducing the need for additional components. This integration results in lower power consumption and increased reliability, ideal for demanding industrial applications.

Typical Applications

  • Industrial Automation: Utilized in control systems for factories, enabling real-time processing and data collection to optimize operations and enhance efficiency.
  • Medical Devices: Supports advanced imaging and diagnostic equipment, providing the necessary processing power for complex algorithms.
  • Telecommunications: Ideal for base station equipment, ensuring robust signal processing and communication capabilities.
  • Automotive Systems: Integrated into vehicle control systems for enhanced safety features and performance monitoring.

XC7Z030-2FFG676E Brand Info

The XC7Z030-2FFG676E is produced by a leading manufacturer known for its innovation in semiconductor technology. With a strong focus on developing high-performance and versatile solutions, this brand integrates advanced processing capabilities with programmable logic to meet the dynamic needs of various industries. Their commitment to quality ensures that this device meets rigorous standards for reliability and efficiency.

FAQ

What are the primary applications of the XC7Z030-2FFG676E?

This device is commonly used in industrial automation, medical devices, telecommunications, and automotive systems, leveraging its dual-core processing and integrated FPGA capabilities for diverse applications.

How does the power consumption of the XC7Z030-2FFG676E compare to similar devices?

The XC7Z030-2FFG676E is designed for low power consumption, making it more efficient than many comparable SoCs, which typically require higher energy levels for similar performance.

What is the temperature range for the XC7Z030-2FFG676E operation?

This device operates within a temperature range of -40??C to +100??C, making it suitable for challenging environments often encountered in industrial applications.

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产品中间询盘

Can the FPGA fabric in the XC7Z030-2FFG676E be modified post-deployment?

Yes, the FPGA fabric is reconfigurable, allowing for updates and modifications even after deployment, which provides flexibility for evolving application requirements.

What type of connectivity does the XC7Z030-2FFG676E support?

The device supports multiple high-speed communication interfaces, enabling seamless integration with various peripherals and other systems, which is essential for complex applications.

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