XC7Z030-2FBG676E FPGA Chip – High-Performance, 676-Pin BGA Package

  • The XC7Z030-2FBG676E excels in processing performance for embedded systems.
  • Features a rich set of I/O interfaces, enhancing connectivity options for diverse projects.
  • Compact BGA package allows for efficient use of board space in tight designs.
  • Ideal for industrial automation, enabling real-time data processing for improved efficiency.
  • Designed with robust quality assurance for reliable operation in critical applications.
SKU: XC7Z030-2FBG676E FPGA Chip - High-Performance, 676-Pin BGA Package Category: Brand:
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XC7Z030-2FBG676E Overview

The XC7Z030-2FBG676E is a versatile System on Chip (SoC) designed for embedded applications that require high performance and low power consumption. Featuring a dual-core ARM Cortex-A9 processor, it integrates programmable logic with advanced peripherals, making it suitable for a wide range of industrial and consumer applications. This device combines processing efficiency with powerful graphics capabilities, enabling engineers to develop sophisticated solutions with ease. For more information, visit IC Manufacturer.

XC7Z030-2FBG676E Key Features

  • Dual-core ARM Cortex-A9 processor: This core architecture delivers exceptional performance, allowing applications to execute complex tasks efficiently.
  • Integrated programmable logic: Provides flexibility to adapt to varying application requirements, streamlining design processes and reducing time-to-market.
  • Low power consumption: Ensures energy efficiency, extending operational lifespan and reducing cooling requirements in deployed systems.
  • Rich peripheral set: Supports various communication interfaces, enhancing connectivity options for diverse applications.

XC7Z030-2FBG676E Technical Specifications

Attribute Specification
Processor Architecture Dual-core ARM Cortex-A9
Clock Speed Up to 1 GHz
Logic Cells 30,000
FPGA Fabric Xilinx 7 Series
Memory Interface DDR3/DDR2
Operating Voltage 0.95-1.05V
Package Type 676 BGA
Temperature Range -40??C to +100??C

XC7Z030-2FBG676E Advantages vs Typical Alternatives

Compared to typical alternatives, this device excels in processing speed and power efficiency, making it ideal for applications requiring both high performance and low thermal output. The integrated programmable logic further enhances its flexibility and adaptability, allowing for customized solutions across various markets.

Typical Applications

  • Industrial Automation: The XC7Z030-2FBG676E is ideal for controlling complex machinery and processes, providing real-time data processing and control capabilities.
  • Medical Devices: Its low power consumption and high reliability make it suitable for portable and stationary medical equipment.
  • Automotive Systems: This device supports advanced driver-assistance systems (ADAS) and infotainment applications with its robust processing power.
  • Consumer Electronics: The integration of graphics and processing capabilities allows for enhanced multimedia experiences in consumer products.

XC7Z030-2FBG676E Brand Info

The XC7Z030-2FBG676E is part of the renowned Xilinx Zynq-7000 series, which combines the power of a processing system and programmable logic. Known for its reliability and performance, Xilinx has positioned this SoC as a leader in the embedded systems market, catering to diverse applications across various industries. This product is backed by extensive support and resources from Xilinx, ensuring a smooth development experience.

FAQ

What are the primary use cases for the XC7Z030-2FBG676E?

This SoC is primarily used in industrial automation, automotive systems, medical devices, and consumer electronics. Its flexibility and performance make it suitable for a variety of applications requiring real-time data processing.

How does the XC7Z030-2FBG676E handle power consumption?

The device is designed with low power consumption in mind, which is crucial for applications that require long operational lifetimes and minimal heat generation, making it ideal for energy-sensitive environments.

What development tools are compatible with this device?

Developers can utilize Xilinx’s Vivado Design Suite, which offers comprehensive tools for designing, debugging, and deploying applications on the XC7Z030-2FBG676E, facilitating an efficient development process.

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产品中间询盘

Can the XC7Z030-2FBG676E support high-speed interfaces?

Yes, the device supports multiple high-speed interfaces, including USB, Ethernet, and CAN, enabling seamless connectivity and communication in complex systems.

What is the operating temperature range for the XC7Z030-2FBG676E?

This SoC operates effectively within a temperature range of -40??C to +100??C, making it suitable for use in harsh environments and demanding applications.

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