XC7S75-2FGGA676I FPGA Chip – High-Performance 676-Pin Package

  • Designed for high-performance applications, the XC7S75-2FGGA676I offers efficient processing capabilities.
  • Features advanced logic resources that support complex designs and enhance functionality.
  • Compact package type enables significant space savings on the PCB, optimizing layout efficiency.
  • Ideal for real-time data processing in communication systems, improving overall system responsiveness.
  • Built with robust quality standards to ensure reliability in demanding environments and applications.
SKU: XC7S75-2FGGA676I FPGA Chip - High-Performance 676-Pin Package Category: Brand:
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产品上方询盘

XC7S75-2FGGA676I Overview

The XC7S75-2FGGA676I is a versatile and high-performance FPGA device designed for a range of industrial applications. With its advanced architecture, it provides enhanced processing capabilities, making it ideal for tasks requiring significant processing power and flexibility. This device is particularly suitable for applications in communications, automotive, and industrial control, offering engineers a reliable solution for their design needs. For more details, visit IC Manufacturer.

XC7S75-2FGGA676I Key Features

  • High Logic Density: The device supports a large number of logic cells, enabling complex designs without increasing footprint.
  • Integrated DSP Blocks: These blocks enhance performance for signal processing tasks, making it essential for applications requiring real-time data analysis.
  • Low Power Consumption: The XC7S75-2FGGA676I is optimized for efficiency, reducing operational costs while maintaining high performance.
  • Flexible I/O Options: With multiple I/O configurations, it supports various communication protocols, facilitating easy integration into diverse systems.

XC7S75-2FGGA676I Technical Specifications

Parameter Value
Device Family 7 Series
Logic Cells 75,000
DSP Slices 90
Maximum I/O Pins 676
Operating Voltage 0.95V to 1.05V
Temperature Range -40??C to +100??C
Package Type FPGA, FGG676
Max Clock Frequency 450 MHz

XC7S75-2FGGA676I Advantages vs Typical Alternatives

The XC7S75-2FGGA676I offers superior performance compared to typical alternatives through its optimized architecture, leading to higher logic density and lower power consumption. This translates to better efficiency and reduced heat generation, making it a reliable choice for demanding applications.

Typical Applications

  • Digital Signal Processing: Ideal for complex algorithms and real-time data processing, enhancing performance in communication systems and audio applications.
  • Industrial Automation: Utilized in control systems for manufacturing processes, improving efficiency and reliability.
  • Automotive Systems: Supports advanced driver assistance systems (ADAS) with high processing capabilities for safety features.
  • Networking Equipment: Facilitates high-speed data transfer and processing in routers and switches, ensuring efficient network performance.

XC7S75-2FGGA676I Brand Info

The XC7S75-2FGGA676I is part of the renowned 7 Series family of FPGAs, known for their flexibility and performance. This device is designed to meet the rigorous demands of various industries, ensuring that engineers have access to reliable and innovative technology.

FAQ

What applications is the XC7S75-2FGGA676I best suited for?

This device is best suited for applications such as digital signal processing, industrial automation, automotive systems, and networking equipment, due to its high logic density and performance capabilities.

What are the key benefits of using the XC7S75-2FGGA676I?

The key benefits include low power consumption, high logic density, and integrated DSP blocks, which collectively enhance performance, efficiency, and flexibility in various applications.

How does the XC7S75-2FGGA676I compare to its competitors?

Compared to its competitors, this device offers superior logic density and lower power consumption, making it an excellent choice for applications requiring high performance in a compact form factor.

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产品中间询盘

What is the operating temperature range for this device?

The XC7S75-2FGGA676I operates effectively within a temperature range of -40??C to +100??C, ensuring reliability in various environmental conditions.

What type of packaging does the XC7S75-2FGGA676I come in?

This FPGA is available in a FGG676 package, which provides a robust solution for mounting in various applications while optimizing space and performance.

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