XC7S50-2FTGB196I FPGA Chip – High-Performance 196-Pin Package

  • The XC7S50-2FTGB196I is designed for high-performance digital signal processing tasks.
  • Features ample logic cells, enabling complex designs and efficient processing capabilities.
  • Compact footprint allows for significant board-space savings in tight design layouts.
  • Ideal for applications in communications, enhancing data throughput and processing speed.
  • Built to meet stringent quality standards, ensuring robust performance and reliability over time.
SKU: XC7S50-2FTGB196I FPGA Chip - High-Performance 196-Pin Package Category: Brand:
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产品上方询盘

XC7S50-2FTGB196I Overview

The XC7S50-2FTGB196I is a versatile and efficient System on Chip (SoC) designed for a range of applications in industrial technology. It integrates advanced processing capabilities, making it ideal for demanding tasks in embedded systems. Its compact form factor and low power consumption ensure it meets the needs of engineers seeking reliability and performance in their designs. For more detailed information, visit IC Manufacturer.

XC7S50-2FTGB196I Key Features

  • High-performance processing core that allows for complex computations, significantly enhancing overall system speed.
  • Low power consumption design, which is crucial for battery-operated devices, extending operational life and reducing energy costs.
  • Integration of multiple functionalities within a single chip, leading to reduced board space and simplified designs for engineers.
  • Robust reliability metrics, ensuring long-term performance in various environmental conditions.

XC7S50-2FTGB196I Technical Specifications

Parameter Value
Technology Node 28nm
Core Count 1
Max Frequency 400 MHz
Logic Cells 50,000
Embedded Memory 5 Mbits
IO Pins 196
Operating Temperature Range -40??C to 100??C
Package Type FTBGA196

XC7S50-2FTGB196I Advantages vs Typical Alternatives

The XC7S50-2FTGB196I stands out against typical alternatives due to its superior integration and processing capabilities. With a compact design, it offers enhanced performance and reliability, making it an ideal choice for engineers who require a robust solution in demanding applications.

Typical Applications

  • Industrial automation systems, where high processing power and reliability are essential for controlling machinery and processes effectively.
  • Medical devices, which require stringent reliability and low power consumption for prolonged operational use.
  • Consumer electronics that benefit from compact size and advanced processing to improve user experience.
  • Automotive applications, particularly in embedded systems for enhanced safety and performance features.

XC7S50-2FTGB196I Brand Info

The XC7S50-2FTGB196I is manufactured by a leading company known for its innovative semiconductor solutions. It embodies cutting-edge technology and is designed to meet the rigorous demands of modern electronics applications, ensuring high performance and reliability.

FAQ

What is the maximum operating frequency of the XC7S50-2FTGB196I?

The XC7S50-2FTGB196I has a maximum operating frequency of 400 MHz, which allows it to handle complex calculations efficiently and improve overall system performance.

What is the temperature range for the XC7S50-2FTGB196I?

This device operates within a temperature range of -40??C to 100??C, making it suitable for various industrial and environmental conditions.

How many logic cells are available in this device?

The XC7S50-2FTGB196I contains 50,000 logic cells, providing substantial flexibility and capability for complex applications and designs.

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产品中间询盘

What package type does the XC7S50-2FTGB196I use?

It is housed in a FTBGA196 package, which offers an efficient layout for connections while minimizing space on the PCB.

Can the XC7S50-2FTGB196I be used in automotive applications?

Yes, this device is well-suited for automotive applications, particularly in embedded systems where reliability and performance are critical for safety features.

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