XC6SLX75T-3FGG676C FPGA Chip – Xilinx Spartan-6, 676-Pin FGG Package

  • The XC6SLX75T-3FGG676C is designed for efficient digital signal processing tasks.
  • It features high-speed performance, ensuring responsive and reliable operation in applications.
  • The compact footprint allows for effective use of board space, optimizing design layouts.
  • This model is suitable for embedded systems, enhancing functionality in various devices.
  • Manufactured to high standards, it ensures consistent performance and long-term reliability.
SKU: XC6SLX75T-3FGG676C FPGA Chip - Xilinx Spartan-6, 676-Pin FGG Package Category: Brand:
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产品上方询盘

XC6SLX75T-3FGG676C Overview

The XC6SLX75T-3FGG676C is a high-performance FPGA that provides a versatile platform for a variety of applications. With its low power consumption and advanced features, this device is ideal for engineers looking to optimize design efficiency while maintaining high reliability. The integration of multiple functions within a compact form factor makes it suitable for both industrial and commercial uses. Learn more about this innovative technology at IC Manufacturer.

XC6SLX75T-3FGG676C Key Features

  • Low power consumption enables longer battery life in portable applications.
  • High logic capacity allows for complex designs, reducing the need for multiple devices.
  • Enhanced integration capabilities streamline design processes, making it easier to manage complex systems.
  • Robust reliability ensures performance in mission-critical applications and harsh environments.

XC6SLX75T-3FGG676C Technical Specifications

Parameter Value
Device Family Spartan-6
Logic Cells 75,000
Flip-Flops 150,000
DSP Slices 90
RAM Bits 4.5 Mbits
Maximum Clock Frequency 550 MHz
Package Type FGG676
Operating Temperature -40 to +100 ??C

XC6SLX75T-3FGG676C Advantages vs Typical Alternatives

This FPGA stands out due to its low power consumption and high logic density, which can lead to significant cost savings in power management. Its integration capabilities allow for simplified designs compared to typical alternatives, making it a strategic choice for engineers focused on efficiency and reliability.

Typical Applications

  • Industrial automation systems where reliable and efficient processing is critical for operational success. This device supports complex control algorithms and real-time processing needs.
  • Telecommunications for base station applications, offering the necessary processing power to handle high data rates.
  • Automotive applications requiring robust performance in harsh environments, ensuring long-term reliability.
  • Aerospace and defense systems that demand high reliability and operational capability under extreme conditions.

XC6SLX75T-3FGG676C Brand Info

The XC6SLX75T-3FGG676C belongs to the Spartan-6 family of FPGAs, designed to provide a cost-effective solution for a wide range of applications. Known for its low power consumption and high performance, this device is trusted by engineers across various industries for its reliability and flexibility in design.

FAQ

What is the power consumption of the XC6SLX75T-3FGG676C?

The power consumption varies based on usage but is designed to be low, making it ideal for battery-operated and energy-efficient applications.

What is the maximum operating temperature for this FPGA?

The XC6SLX75T-3FGG676C can operate in temperatures ranging from -40 to +100 ??C, making it suitable for harsh environmental conditions.

Can the XC6SLX75T-3FGG676C be used in automotive applications?

Yes, this FPGA is suitable for automotive applications due to its robustness and ability to perform reliably under extreme conditions.

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产品中间询盘

What type of package does the XC6SLX75T-3FGG676C come in?

This device is available in an FGG676 package type, which is designed for effective thermal management and space efficiency.

How many logic cells does the XC6SLX75T-3FGG676C have?

The device features 75,000 logic cells, providing ample capacity for complex application needs and design flexibility.

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