XC6SLX75-3FGG676I FPGA Chip – Xilinx Low-Power, 676-Pin FGG Package

  • The XC6SLX75-3FGG676I serves as a versatile FPGA for complex applications.
  • It features advanced logic cells, enhancing processing capabilities for efficient designs.
  • This model comes in a compact package, saving valuable board space in projects.
  • Ideal for signal processing tasks, it optimizes performance in real-time environments.
  • Designed for durability, it ensures dependable operation in various applications.
SKU: XC6SLX75-3FGG676I FPGA Chip - Xilinx Low-Power, 676-Pin FGG Package Category: Brand:
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XC6SLX75-3FGG676I Overview

The XC6SLX75-3FGG676I is a powerful and flexible FPGA solution designed for industrial applications. With its advanced architecture and low power consumption, this device offers engineers a reliable platform for implementing complex designs. The integration capabilities of this FPGA enable quick deployment and efficient resource utilization, making it ideal for various applications in automation, communications, and data processing. For more details, visit IC Manufacturer.

XC6SLX75-3FGG676I Key Features

  • High Logic Capacity: With 75,000 logic cells, this FPGA supports complex designs, allowing for the implementation of sophisticated algorithms and functions.
  • Low Power Operation: Operating at a lower power threshold improves energy efficiency, making it suitable for battery-powered applications.
  • Flexible I/O Configuration: The customizable I/O options help engineers optimize connectivity for various interfaces, enhancing integration with existing systems.
  • Rapid Prototyping: The device’s architecture supports quick turnaround times for developing and testing new designs, reducing time-to-market.

XC6SLX75-3FGG676I Technical Specifications

Parameter Value
Logic Cells 75,000
RAM Blocks 4.9 Mb
Maximum I/O Pins 676
Operating Voltage 1.2V
Package Type FG676
Speed Grade -3
Configuration Flash
Temperature Range -40??C to +100??C

XC6SLX75-3FGG676I Advantages vs Typical Alternatives

This FPGA stands out against typical alternatives due to its superior logic capacity and low power consumption. These features enable engineers to create more complex designs without compromising performance, ensuring reliability in demanding environments.

Typical Applications

  • Industrial Automation: Ideal for controlling machinery and automating processes, the device enhances operational efficiency and minimizes downtime.
  • Data Processing: Suitable for high-speed data handling and processing tasks in various industries, including telecommunications and computing.
  • Communication Systems: Utilized in designing robust communication protocols, ensuring reliable data transmission in network systems.
  • Embedded Systems: Its flexible architecture supports integration into various embedded applications, enhancing product functionality.

XC6SLX75-3FGG676I Brand Info

The XC6SLX75-3FGG676I is part of a renowned family of FPGAs designed by a leading semiconductor manufacturer. Known for innovation and quality, the brand focuses on providing high-performance solutions that meet the evolving needs of engineers in various sectors. This specific model reflects the brand’s commitment to delivering reliable, efficient, and versatile products for complex design challenges.

FAQ

What is the maximum operating temperature for the XC6SLX75-3FGG676I?

The maximum operating temperature for this device is 100??C, making it suitable for various industrial environments where temperature variations may occur.

How many logic cells does the XC6SLX75-3FGG676I have?

This FPGA features 75,000 logic cells, providing ample capacity for implementing complex designs and algorithms across diverse applications.

What is the power supply voltage for the XC6SLX75-3FGG676I?

The device operates at a supply voltage of 1.2V, which contributes to its low power consumption and efficiency, especially in battery-operated systems.

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What type of configuration does the XC6SLX75-3FGG676I use?

This FPGA utilizes flash configuration, allowing for quick and reliable setup, which is ideal for prototyping and production environments.

Can the XC6SLX75-3FGG676I be used in automotive applications?

Yes, the device is designed to operate within a broad temperature range, making it suitable for automotive applications that require reliability and performance under varying conditions.

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