XC6SLX45-3FGG676I FPGA Development Chip – 676-Pin FGG Package

  • The XC6SLX45-3FGG676I is designed for efficient digital signal processing tasks.
  • It features a high logic cell count that supports complex applications effectively.
  • This model comes in a compact package, saving valuable board space.
  • Ideal for automotive applications, it enhances performance in critical systems.
  • Built with robust manufacturing standards, ensuring reliable and consistent operation.
SKU: XC6SLX45-3FGG676I FPGA Development Chip - 676-Pin FGG Package Category: Brand:
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产品上方询盘

XC6SLX45-3FGG676I Overview

The XC6SLX45-3FGG676I is a versatile, low-power FPGA designed for a wide range of applications, offering flexible integration and high performance. This device balances power efficiency with robust processing capabilities, making it an ideal choice for engineers looking to optimize designs in embedded systems, communications, and automotive applications. For more information about this product, visit IC Manufacturer.

XC6SLX45-3FGG676I Key Features

  • Low Power Consumption: The architecture is optimized for low power, enabling efficient performance in battery-operated devices.
  • High Logic Capacity: With 45,000 logic cells, it supports complex designs that require significant processing capabilities, which is crucial for advanced applications.
  • Flexible I/O Options: The device includes various I/O standards, allowing seamless integration with different system components and enhancing design flexibility.
  • Built-in DSP Slices: The inclusion of dedicated DSP resources enhances signal processing capabilities, making it suitable for applications like video processing and communications.

XC6SLX45-3FGG676I Technical Specifications

Parameter Description
Logic Cells 45,000
Max I/O Pins 676
Built-in RAM 2.2 Mb
DSP Slices 90
Supply Voltage 1.2V
Package Type FG676
Temperature Range -40??C to +100??C
Max Clock Frequency 400 MHz

XC6SLX45-3FGG676I Advantages vs Typical Alternatives

This device offers significant advantages over typical alternatives through its combination of low power consumption and high logic capacity. Such attributes not only enhance performance in demanding applications but also increase system reliability and efficiency, making it an excellent choice for engineers focused on optimizing their designs.

Typical Applications

  • Embedded Systems: Ideal for complex embedded designs that require efficient processing capabilities, allowing for quicker response times and lower power usage.
  • Communications: Suitable for advanced communication systems that demand high-speed data processing and flexible I/O options.
  • Automotive Applications: Designed to meet the rigorous standards of automotive electronics, ensuring reliability in harsh environments.
  • Industrial Automation: Perfect for automating processes with its ability to handle real-time data processing and control.

XC6SLX45-3FGG676I Brand Info

The XC6SLX45-3FGG676I is part of a renowned brand known for its high-performance FPGAs. This product line emphasizes flexibility and efficiency, catering to engineers’ needs in various sectors, from telecommunications to industrial automation. The brand is recognized for its commitment to innovation, providing advanced solutions that facilitate the development of sophisticated electronic systems.

FAQ

What is the power consumption of the XC6SLX45-3FGG676I?

The power consumption of the XC6SLX45-3FGG676I is optimized to be low, making it suitable for applications where energy efficiency is critical. This feature is particularly beneficial in battery-powered devices.

Can the XC6SLX45-3FGG676I be used in automotive applications?

Yes, this device is designed to operate effectively in automotive environments, meeting stringent reliability and temperature requirements. It is suitable for a variety of automotive applications.

What types of I/O standards does the XC6SLX45-3FGG676I support?

The XC6SLX45-3FGG676I supports multiple I/O standards, allowing for flexible integration with different system components. This adaptability is crucial for engineers designing complex systems.

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产品中间询盘

How does the DSP capability affect application performance?

The built-in DSP slices in this device enhance its signal processing capabilities, allowing for faster and more efficient handling of complex algorithms, which is vital in applications like video and communications processing.

What is the maximum operating temperature for the XC6SLX45-3FGG676I?

This device operates within a temperature range of -40??C to +100??C, making it suitable for demanding environments where temperature fluctuations can occur.

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