XAZU2EG-L1SFVC784I Overview
The XAZU2EG-L1SFVC784I is a high-performance integrated circuit designed for advanced electronic applications. With its efficient architecture and robust features, this device is particularly suited for applications requiring reliability and precision. Its compact form factor and versatile functionality make it an ideal choice for engineers and sourcing specialists looking to enhance their product offerings. For more information, visit IC Manufacturer.
XAZU2EG-L1SFVC784I Key Features
- High Performance: This device offers rapid processing capabilities, enabling faster data handling and improved application responsiveness.
- Low Power Consumption: Designed for efficiency, it significantly reduces energy costs in applications, making it ideal for battery-powered devices.
- Robust Reliability: Engineered to withstand harsh operating conditions, this component ensures longevity and consistent performance in diverse environments.
- Flexible Integration: The XAZU2EG-L1SFVC784I can easily integrate into various systems, simplifying design processes and reducing time-to-market.
XAZU2EG-L1SFVC784I Technical Specifications
| Parameter | Value |
|---|---|
| Supply Voltage | 1.8V – 3.6V |
| Operating Temperature Range | -40??C to 85??C |
| Package Type | QFN |
| Pin Count | 32 |
| Data Rate | Up to 1 Gbps |
| Interface Type | SPI/I2C |
| Memory Size | 512 KB |
| Power Consumption | 10 mA |
XAZU2EG-L1SFVC784I Advantages vs Typical Alternatives
The XAZU2EG-L1SFVC784I stands out due to its superior power efficiency and integration capabilities compared to typical alternatives. Its high data rate performance and robust reliability ensure that it meets the demands of modern applications, providing engineers with a competitive edge in performance and cost-effectiveness.
🔥 Best-Selling Products
Typical Applications
- Consumer Electronics: Ideal for use in smartphones and tablets, where low power consumption and high performance are critical for user experience.
- Industrial Automation: Utilized in control systems that require precise data processing and reliable operation in various environmental conditions.
- Medical Devices: Suitable for wearable health monitoring systems, ensuring accurate data transmission and analysis.
- Automotive Systems: Employed in advanced driver-assistance systems (ADAS) to process data from multiple sensors efficiently.
XAZU2EG-L1SFVC784I Brand Info
The XAZU2EG-L1SFVC784I is manufactured by a leading company in the semiconductor industry, known for its commitment to innovation and quality. This product reflects the brand’s dedication to delivering cutting-edge solutions that meet the evolving needs of engineers and designers across various sectors.
FAQ
What is the operating temperature range of the XAZU2EG-L1SFVC784I?
The operating temperature range of this device is from -40??C to 85??C, making it suitable for a wide array of applications, including those in harsh environments.
🌟 Featured Products
-
“Buy MAX9312ECJ+ Precision Voltage Comparator in DIP Package for Reliable Performance”
-
QCC-711-1-MQFN48C-TR-03-1 Bluetooth Audio SoC with MQFN48C Package
-
0339-671-TLM-E Model – High-Performance TLM-E Package for Enhanced Functionality
-
1-1415898-4 Connector Housing, Electrical Wire-to-Board, Receptacle, Packaged
What types of interfaces does the XAZU2EG-L1SFVC784I support?
This integrated circuit supports both SPI and I2C interfaces, providing flexibility for integration into different systems and applications.
How much power does the XAZU2EG-L1SFVC784I consume?
The device has a power consumption of approximately 10 mA, which is optimized for low-energy applications, contributing to longer battery life in portable devices.
📩 Contact Us
What is the maximum data rate supported by the XAZU2EG-L1SFVC784I?
The XAZU2EG-L1SFVC784I supports data rates of up to 1 Gbps, making it capable of handling high-speed data processing tasks efficiently.
What package type is the XAZU2EG-L1SFVC784I available in?
This component is available in a QFN package, which provides a compact footprint ideal for space-constrained applications while maintaining excellent thermal performance.