WINCS02ICT-I/ZZX Overview
The WINCS02ICT-I/ZZX is a high-performance integrated circuit designed to meet demanding industrial electronic applications. Engineered for precision and reliability, it offers robust operational characteristics suitable for complex system designs. This component supports enhanced power efficiency and signal integrity, making it a preferred choice for engineers seeking a dependable semiconductor solution. With a compact form factor and advanced specifications, it ensures seamless integration into various control and processing units. For detailed technical support and procurement, visit IC Manufacturer.
WINCS02ICT-I/ZZX Technical Specifications
| Parameter | Specification |
|---|---|
| Operating Voltage | 3.3 V ?? 10% |
| Maximum Operating Frequency | 50 MHz |
| Input Logic Levels | TTL Compatible |
| Power Consumption | 120 mW (typical) |
| Operating Temperature Range | -40??C to +85??C |
| Package Type | 32-pin QFP |
| Signal I/O Count | 24 |
| ESD Protection | ??4 kV HBM |
WINCS02ICT-I/ZZX Key Features
- High-frequency operation: Supports up to 50 MHz, enabling fast data processing and reducing latency in complex electronic systems.
- Low power consumption: Typical power usage of 120 mW enhances energy efficiency, extending device lifetime and reducing thermal management requirements.
- Wide operating temperature range: Functional stability from -40??C to +85??C ensures reliable performance in harsh industrial environments.
- Robust ESD protection: ??4 kV Human Body Model rating safeguards against electrostatic discharge, improving device durability and system reliability.
WINCS02ICT-I/ZZX Advantages vs Typical Alternatives
This IC provides superior power efficiency and frequency capability compared to many standard alternatives, making it ideal for applications requiring both speed and low energy consumption. Its robust operating temperature range and advanced ESD protection enhance reliability in industrial settings. The compact 32-pin QFP package facilitates easier integration while maintaining signal integrity and minimizing board space.
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Typical Applications
- Industrial control systems requiring precise timing and robust environmental tolerance, benefiting from the device??s high-frequency capability and temperature resilience.
- Embedded processing units in automation equipment where low power consumption reduces overall system energy demands.
- Communication interface modules that benefit from TTL-compatible input logic levels for seamless connectivity.
- Consumer electronics needing compact, reliable semiconductor components to maintain performance consistency under variable conditions.
WINCS02ICT-I/ZZX Brand Info
The WINCS02ICT-I/ZZX is part of a trusted product line known for delivering quality and performance in industrial-grade integrated circuits. This product exemplifies the brand??s commitment to innovation, reliability, and customer-focused design. It is manufactured under strict quality control standards to ensure consistent operation and longevity in demanding applications. The brand supports engineers and sourcing specialists with comprehensive documentation and responsive technical assistance, facilitating smooth product integration and lifecycle management.
FAQ
What is the maximum operating frequency of this device?
The device supports a maximum operating frequency of 50 MHz, allowing it to process high-speed signals effectively in various industrial and embedded applications.
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What voltage range does the WINCS02ICT-I/ZZX operate within?
This integrated circuit operates at a nominal voltage of 3.3 V with a tolerance of ??10%, ensuring compatibility with common power supply standards in industrial electronics.
How does the device handle electrostatic discharge protection?
It features a robust ??4 kV Human Body Model (HBM) rating for ESD protection, which helps prevent damage during handling and operation, enhancing system reliability.
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What temperature range can this component function reliably in?
The operating temperature range spans from -40??C to +85??C, making it suitable for use in harsh environments commonly encountered in industrial and outdoor applications.
What package type is used for this integrated circuit?
The chip is housed in a 32-pin Quad Flat Package (QFP), which provides a compact footprint while allowing for efficient heat dissipation and straightforward PCB layout integration.
