TMS5700914APGEQQ1 Overview
The TMS5700914APGEQQ1 is an automotive-grade microcontroller in the TMS570 family from IC Manufacturer. It targets safety-critical embedded systems requiring functional-safety certification and deterministic real-time performance. The device combines a safety-oriented MCU architecture with automotive qualification, wide operating temperature support, and a compact ball-grid package to simplify board-level integration for control, monitoring, and real-time signal processing tasks.
TMS5700914APGEQQ1 Technical Specifications
| Part number | TMS5700914APGEQQ1 |
| Device family | TMS570 series (automotive/safety MCU) |
| Functional safety | ASIL?D capable (safety-focused architecture) |
| Core architecture | ARM-based safety MCU (TMS570 family) |
| Package type | PGEQ ball?grid package |
| Package pins | 176 pins (BGA style) |
| Operating temperature | ?40 ??C to +125 ??C (automotive grade) |
| Automotive grade | AEC?Q100 / Q1 level qualification |
| Supply I/O | 3.3 V I/O compatible (typical automotive MCU level) |
| RoHS / lead-free | Compliant (Q1 / automotive orderable code) |
TMS5700914APGEQQ1 Key Features
- Safety?centric MCU architecture with hardware features and certification support that help meet ISO 26262 objectives for ASIL?D systems.
- Automotive qualification (AEC?Q100 / Q1) which matters for long-term deployment in vehicles and strict supply?chain sourcing.
- Wide temperature range spanning ?40 ??C to +125 ??C for robust operation in harsher automotive and industrial environments.
- Compact PGEQ package that offers a high pin count in a small footprint, improving board density and integration for complex control applications.
Typical Applications
- Engine and powertrain control modules where deterministic real?time response and safety certification are required for control loops and diagnostics over the vehicle lifecycle.
- Brake and steering electronic control units that demand ASIL?D functional safety support, multi?channel sensor inputs, and high reliability in extreme temperature conditions.
- Automotive body and chassis systems implementing advanced diagnostics, watchdogs, and fail?safe behaviors, where automotive qualification and long-term availability are required.
- Industrial motor control and safety relays that need rugged automotive?grade performance, deterministic timing, and compact packages for space?constrained controllers.
TMS5700914APGEQQ1 Advantages vs Typical Alternatives
The device emphasizes automotive functional safety and qualification versus many general?purpose MCUs. It provides a more direct path to ASIL?D compliance, wider temperature tolerance (?40 ??C to +125 ??C), and an automotive orderable code for supply?chain traceability. For engineers and sourcing teams, the PGEQ high?pin BGA offers denser I/O integration compared with larger pin?count DIP or LQFP alternatives while keeping board area and weight lower for production vehicles.
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TMS5700914APGEQQ1 Brand Info
The part is manufactured by Texas Instruments, a global semiconductor supplier known for robust industrial and automotive microcontrollers. Texas Instruments positions the TMS570 family for safety?critical embedded systems, combining hardened MCU architectures, long product lifecycles, and automotive qualification to support engineering and sourcing needs in demanding markets.
FAQ
Is this part automotive qualified?
Yes. The ordering code and device family correspond to automotive qualification levels suitable for vehicle systems. It is intended for AEC?Q100 / Q1 supply?chain and production environments.
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What temperature range does it support?
The device supports a wide automotive operating range from ?40 ??C up to +125 ??C, meeting the thermal requirements typical for in?vehicle and harsh industrial deployments.
Does it support functional?safety standards?
Yes. The MCU is part of a safety?focused product family designed to meet ISO 26262 objectives and is targeted for ASIL?D capable system architectures and safety certification workflows.
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What package should I expect for PCB layout?
The device comes in a PGEQ ball?grid style package with a high pin count appropriate for dense I/O mapping; evaluate BGA design rules and thermal considerations for reliable soldering and assembly.
Where can sourcing specialists obtain procurement data?
Orderable codes, qualification documentation, and lifecycle attributes are supplied through official distributor channels and the manufacturer??s product pages to support purchasing, compliance, and long?term availability planning.