TM4C1290NCZADI3R ARM Cortex-M4F Microcontroller, Tape & Reel

TM4C1290NCZADI3R Overview

The TM4C1290NCZADI3R is cited here for content development, but the authoritative technical sheet for exact specifications is required to write a fully accurate product description. With the sheet in hand, content can highlight core performance, I/O count, integrated communications, and packaging details that matter to engineers and sourcing teams. For sourcing references and corporate information see IC Manufacturer. Supply the official specification sheet to enable a precise, numbers-driven product page tailored for procurement and design engineers.

TM4C1290NCZADI3R Technical Specifications

TM4C1290NCZADI3R Key Features

• Integrated processing ?? Core-level performance enables deterministic real-time control useful in industrial automation tasks.
• Multiple high-speed peripherals ?? On-chip communications reduce external component count and simplify PCB routing for embedded networked systems.
• Scalable I/O ?? Rich GPIO and serial interfaces allow flexible partitioning between control, sensing, and human interface subsystems.
• Robust packaging options ?? Industrial-grade package choices support deployment across harsher environments when specified in the official sheet.

Typical Applications

• Industrial gateway and protocol converter designs that require deterministic control plus wired networking and multiple serial interfaces for fieldbus translation.
• Embedded ethernet-enabled controllers for building automation where consolidated Ethernet, USB, and GPIO reduce BOM and speed development cycles.
• High-channel data acquisition and control modules that need integrated ADC/DAC support and substantial on-chip memory for local buffering and processing.
• Networked instrumentation and remote telemetry nodes that require robust packaging and temperature range for continuous industrial operation.

TM4C1290NCZADI3R Advantages vs Typical Alternatives

The device can offer tighter system integration compared with standalone MCU-plus-network-controller combinations. Fewer external components reduce board area and assembly cost. On-chip communications stacks lower software integration effort and enable faster time-to-market. For procurement, a single-package solution simplifies sourcing and stocking compared with multi-chip alternatives. Final competitive claims and numerical comparisons require confirmation from the official specification sheet to ensure accurate performance and compliance claims.

TM4C1290NCZADI3R Brand Info

TM4C1290NCZADI3R is associated with Texas Instruments (TI), a global semiconductor company known for microcontrollers and analog solutions. TI provides development tools, software libraries, and long-term product support that help engineers integrate devices into industrial designs.

FAQ

What core does this device use?

Exact core type and revision are specified on the official datasheet. That document lists the processor core family, any FPU/MBR support, and applicable clock-rate limits for design verification.

Where to find pinout and package details?

Pinout diagrams, mechanical dimensions, and package options are published in the product datasheet and mechanical drawing. Use those documents for footprint creation and thermal considerations.

How to obtain software support and examples?

Software libraries, driver examples, and development tools are typically provided by the device vendor. Check the vendor??s developer resources and SDK for board support packages and sample code.

What environmental ratings apply?

Operating temperature range, humidity, and storage ratings are defined in the product specification sheet. Confirm those ratings before deploying in industrial or outdoor systems.

Where to verify supply-chain options?

Authorized distributors and the manufacturer??s orderable part-number documentation list packaging, MOQ, lead times, and lifecycle status. Refer to those official channels for procurement decisions.