TESEO-LIV3F Overview
The TESEO-LIV3F is a cutting-edge GNSS module designed to deliver precise positioning, navigation, and timing capabilities for industrial and automotive applications. Featuring multi-constellation support, it ensures robust satellite tracking and enhanced location accuracy under challenging environments. This module integrates advanced positioning algorithms and low power consumption, making it ideal for high-reliability scenarios requiring real-time data. With its compact form factor and flexible interface options, the TESEO-LIV3F offers seamless integration into diverse systems. For sourcing and technical details, visit IC Manufacturer.
TESEO-LIV3F Technical Specifications
| Parameter | Description |
|---|---|
| GNSS Constellations Supported | GPS, GLONASS, Galileo, BeiDou |
| Update Rate | Up to 10 Hz |
| Position Accuracy | 2.5 m CEP (Circular Error Probable) |
| Power Supply | 3.0 V to 3.6 V |
| Current Consumption | Typical 20 mA in tracking mode |
| Interface | UART, SPI, I2C |
| Operating Temperature Range | -40??C to +85??C |
| Dimensions | 10.1 mm ?? 9.7 mm ?? 2.5 mm |
| Antenna Type | Active and passive antenna support |
TESEO-LIV3F Key Features
- Multi-constellation GNSS support: Enables simultaneous tracking of GPS, GLONASS, Galileo, and BeiDou satellites, ensuring improved positioning accuracy and availability even in urban canyon or dense foliage.
- High update rate up to 10 Hz: Delivers smooth and real-time position updates critical for dynamic applications such as automotive navigation and fleet management.
- Low power consumption: Optimized for energy efficiency, extending operational lifetime in battery-powered devices without compromising performance.
- Robust industrial temperature range: Suitable for harsh environments, ensuring reliable operation across extended temperature extremes.
- Multiple communication interfaces: UART, SPI, and I2C offer versatile integration options for embedded system designers.
- Compact form factor: Facilitates easy integration into space-constrained applications while maintaining high performance.
Typical Applications
- Precision navigation for automotive systems, including advanced driver-assistance systems (ADAS) and vehicle tracking, where reliable and accurate positioning is essential for safety and efficiency.
- Industrial asset tracking solutions, enabling real-time location monitoring of equipment and goods across wide logistics networks.
- Unmanned aerial vehicle (UAV) navigation, providing stable and accurate geolocation data critical for autonomous flight control.
- Wearable devices requiring precise outdoor positioning and low power consumption for extended battery life during field operations.
TESEO-LIV3F Advantages vs Typical Alternatives
This GNSS module stands out by combining multi-constellation support with low power consumption and a robust industrial temperature range. Compared to typical alternatives, it offers superior positioning accuracy and faster update rates, crucial for dynamic and safety-critical applications. Its flexible interface options and compact size enhance integration versatility, while its reliable performance under harsh conditions ensures dependable operation in demanding industrial and automotive environments.
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TESEO-LIV3F Brand Info
The TESEO-LIV3F module is part of the STMicroelectronics GNSS product portfolio, a globally recognized semiconductor leader known for innovation in embedded systems and industrial electronics. STMicroelectronics specializes in delivering high-performance, energy-efficient solutions suitable for automotive, industrial, and consumer applications. The TESEO-LIV3F leverages ST??s expertise in GNSS technology to provide reliable, precise positioning capabilities, backed by comprehensive support and proven integration experience.
FAQ
What GNSS constellations does the TESEO-LIV3F support?
The module supports GPS, GLONASS, Galileo, and BeiDou satellite systems. This multi-constellation capability enhances satellite visibility and positioning accuracy, especially in challenging environments such as urban canyons or dense foliage.
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What interfaces are available for data communication with the module?
It offers multiple communication interfaces, including UART, SPI, and I2C, allowing flexible
