STPS5H100AFY Overview
The STPS5H100AFY is a high-performance ultra-fast dual diode designed to optimize power efficiency and thermal management in industrial and automotive applications. With a low forward voltage drop and rapid recovery time, this device reduces switching losses, enabling improved system reliability and energy savings. Its robust avalanche capability and compact surface-mount package provide excellent integration flexibility for engineers seeking a durable and efficient solution. The STPS5H100AFY is ideal for applications requiring high current handling, fast switching, and reliable performance under demanding conditions. For detailed technical support and sourcing, visit IC Manufacturer.
STPS5H100AFY Technical Specifications
| Parameter | Value |
|---|---|
| Type | Ultra-Fast Dual Diode |
| Maximum Repetitive Peak Reverse Voltage (VRRM) | 100 V |
| Average Forward Current (IF(AV)) | 5 A |
| Peak Forward Surge Current (IFSM) | 80 A |
| Forward Voltage Drop (VF) at IF=3.5 A | 0.85 V (typical) |
| Reverse Recovery Time (trr) | 35 ns (typical) |
| Junction Temperature Range (Tj) | -65??C to +150??C |
| Package | TO-263 (D2PAK) |
| Thermal Resistance Junction to Case (R??JC) | 3.0 ??C/W |
STPS5H100AFY Key Features
- Ultra-fast recovery: Minimizes switching losses, improving efficiency in high-frequency converters and power supplies.
- Low forward voltage drop: Reduces conduction losses, enabling better thermal management and lower energy consumption.
- High surge current capability: Supports transient overloads, enhancing circuit robustness during power spikes.
- Wide junction temperature range: Ensures reliable operation in harsh environments and extended temperature conditions.
- Compact TO-263 package: Facilitates easy PCB mounting and effective heat dissipation for industrial applications.
Typical Applications
- Switching power supplies in industrial equipment requiring efficient rectification and minimal power loss at high switching frequencies.
- Automotive DC-DC converters where thermal performance and fast recovery diodes are critical for system reliability.
- Uninterruptible power supplies (UPS) to ensure quick response and high current capacity during power interruptions.
- Motor drive inverters that benefit from low forward voltage and fast switching to enhance overall system efficiency.
STPS5H100AFY Advantages vs Typical Alternatives
This device offers superior switching speed and a significantly lower forward voltage drop compared to standard diodes, which reduces overall power dissipation and heat generation. Its high surge current capability and robust avalanche rating enhance reliability under transient conditions. The compact TO-263 package supports efficient thermal management, making it a preferred choice for engineers seeking durable, energy-efficient rectification solutions in demanding industrial and automotive environments.
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STPS5H100AFY Brand Info
The STPS5H100AFY is manufactured by STMicroelectronics, a global leader in semiconductor solutions. STMicroelectronics specializes in designing innovative power management devices that meet stringent reliability and efficiency standards. This ultra-fast diode series exemplifies ST??s commitment to providing high-quality components optimized for modern power electronics, combining performance with robust packaging suitable for a wide range of industrial and automotive applications.
FAQ
What is the maximum reverse voltage rating of this diode?
The device supports a maximum repetitive peak reverse voltage of 100 V, making it suitable for medium-voltage rectification tasks in power supplies and automotive circuits.
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How does the forward voltage drop affect system efficiency?
A lower forward voltage drop reduces conduction losses, which means less heat is generated during current flow. This improves overall system efficiency and reduces the cooling requirements for the device.
What package type is used and why is it beneficial?
The TO-263 (D2PAK) package offers excellent thermal dissipation and mechanical robustness. Its surface-mount design simplifies PCB integration while effectively managing heat in high-power applications.
