STPS3150RL Overview
The STPS3150RL is a high-performance ultrafast power rectifier diode designed to deliver efficient switching and low forward voltage drop, enhancing power conversion efficiency in industrial applications. Featuring a rugged package and robust electrical characteristics, it ensures reliable operation in demanding environments. This device supports high surge current capability and low reverse recovery time, making it ideal for power supplies, inverters, and motor drives. The compact surface-mount design optimizes PCB space while maintaining thermal efficiency. For detailed sourcing and technical support, visit IC Manufacturer.
STPS3150RL Technical Specifications
| Parameter | Value |
|---|---|
| Maximum Repetitive Peak Reverse Voltage (VRRM) | 150 V |
| Maximum Average Forward Rectified Current (IF(AV)) | 3.15 A |
| Surge Non-Repetitive Forward Current (IFSM) | 60 A |
| Maximum Forward Voltage Drop (VF) at IF | 0.52 V @ 3.15 A |
| Reverse Recovery Time (trr) | 35 ns (typical) |
| Junction Temperature Range (Tj) | -55 ??C to +150 ??C |
| Thermal Resistance Junction to Ambient (R??JA) | 75 ??C/W |
| Package Type | DO-214AB (SMA) |
STPS3150RL Key Features
- Ultrafast recovery time: Minimizes switching losses in power applications, improving overall system efficiency.
- Low forward voltage drop: Reduces conduction losses, which enhances thermal management and power savings.
- High surge current capability: Ensures robust operation during transient events, increasing device reliability and lifespan.
- Compact surface-mount package: Enables high-density PCB layouts with excellent thermal dissipation properties.
Typical Applications
- Power factor correction (PFC) circuits in switch-mode power supplies, where efficient rectification and low losses are critical for meeting energy standards.
- Freewheeling diode in motor control inverters, helping to protect the switching components and improve system responsiveness.
- DC-DC converters in industrial automation equipment, providing fast switching and minimal losses for reliable operation.
- Uninterruptible power supplies (UPS), ensuring efficient power delivery and fast recovery during load changes or power interruptions.
STPS3150RL Advantages vs Typical Alternatives
This diode offers a compelling balance of low forward voltage and ultrafast recovery time compared to standard rectifiers, leading to lower power dissipation and enhanced efficiency. Its high surge current capacity and rugged DO-214AB package improve durability in industrial environments. These advantages translate into better thermal performance and longer device life, making it a superior choice for demanding power conversion and motor drive applications.
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STPS3150RL Brand Info
The STPS3150RL is manufactured by STMicroelectronics, a global leader in semiconductor solutions. STMicroelectronics specializes in power management and discrete components that enable efficient energy use and robust performance in industrial and automotive applications. The STPS3150RL is part of ST??s portfolio of ultrafast power diodes, designed to meet the stringent requirements of modern power electronics with a focus on reliability, high efficiency, and compact design.
FAQ
What is the maximum repetitive peak reverse voltage for this diode?
The maximum repetitive peak reverse voltage is 150 volts, which defines the highest voltage the diode can block repeatedly without breakdown, ensuring safe operation in typical industrial power circuits.
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How does the low forward voltage drop benefit my application?
A low forward voltage drop reduces conduction losses during diode operation, leading to less heat generation and improved overall power efficiency, which is crucial for energy-sensitive designs.
Can this diode handle high surge currents?
Yes, it supports a surge non-repetitive forward current of up to 60 amperes, allowing it to withstand transient current spikes typical in motor startup or fault conditions without damage.
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What package does this diode come in and why is it important?
The device is housed in a DO-214AB (SMA) package, which is a compact surface-mount form factor that supports efficient PCB space utilization and good thermal dissipation for reliable
