STMicroelectronics STPS630CSFY Schottky Diode 3A 30V SMC Package

  • Provides efficient rectification to reduce power loss and improve energy conversion in electronic circuits.
  • Features a low forward voltage drop that minimizes heat generation and enhances overall system efficiency.
  • Compact package design saves board space, allowing for denser component placement in tight layouts.
  • Ideal for power supply designs where reliable and efficient current handling is critical for performance.
  • Manufactured to meet rigorous quality standards, ensuring consistent operation under varying conditions.
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STPS630CSFY Overview

The STPS630CSFY is a high-efficiency dual Schottky rectifier designed for fast switching and low forward voltage drop. With a maximum repetitive peak reverse voltage of 30V and a forward current rating of 6A, this device is optimized for power supply circuits requiring minimal losses and enhanced thermal performance. Its compact SMC package supports reliable mounting and heat dissipation, making it ideal for industrial and consumer electronics applications. The rectifier??s low reverse recovery time reduces switching losses, improving overall system efficiency. For more detailed semiconductor products, visit IC Manufacturer.

STPS630CSFY Technical Specifications

ParameterValueUnit
Maximum Repetitive Peak Reverse Voltage (VRRM)30V
Maximum Average Forward Current (IF(AV))6A
Forward Voltage Drop (VF) at IF = 3A0.48 (Typ.)V
Reverse Current (IR) at VR = 25V0.5mA
Reverse Recovery Time (trr)35ns
Operating Junction Temperature Range (Tj)-55 to +150??C
Storage Temperature Range (Tstg)-55 to +150??C
Package TypeSMC (DO-214AB)?C

STPS630CSFY Key Features

  • Low forward voltage drop: Reduces conduction losses, improving power efficiency in switching power supplies.
  • Fast switching capability: Minimizes reverse recovery time to decrease switching losses and electromagnetic interference.
  • High surge current tolerance: Enhances reliability under transient conditions and load variations.
  • Compact SMC package: Facilitates efficient heat dissipation and easy PCB integration in space-constrained designs.

Typical Applications

  • Switching power supplies: Efficient rectification and reduced power dissipation improve overall converter performance in industrial and consumer electronics.
  • Polarity protection circuits: Protect sensitive circuits from reverse voltage damage with minimal voltage drop.
  • Freewheeling diodes for inductive loads: Ensures fast response and low loss during switching of motors and relays.
  • DC-DC converters: Supports high-frequency operation with low forward voltage and rapid switching to maximize efficiency.

STPS630CSFY Advantages vs Typical Alternatives

This device offers significant advantages over standard rectifiers by combining a low forward voltage drop with fast switching speed, reducing both conduction and switching losses. The high surge current capability ensures robustness in demanding industrial environments. Its compact SMC package improves thermal management and eases assembly, making it a superior choice for engineers seeking reliable, efficient rectification solutions.

STPS630CSFY Brand Info

The STPS630CSFY is manufactured by STMicroelectronics, a leading global semiconductor company known for innovative power and discrete devices. STMicroelectronics designs this dual Schottky rectifier to meet the rigorous demands of modern power electronics, leveraging advanced silicon technology for enhanced efficiency and reliability. The product aligns with ST??s commitment to delivering high-quality, application-optimized components for industrial, automotive, and consumer markets.

FAQ

What is the maximum forward current rating of this Schottky rectifier?

The maximum average forward current rating is 6 amperes, which allows the device to handle moderate current loads typical in power supply and protection circuits without overheating or degradation.

How does the low forward voltage drop benefit my circuit design?

A lower forward voltage drop reduces conduction losses during operation, which improves overall power efficiency and reduces heat generation. This is critical for power-sensitive applications and helps extend system lifetime.

What package type is this

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