STGP30M65DF2 Overview
The STGP30M65DF2 is a high-performance insulated-gate bipolar transistor (IGBT) designed for demanding industrial power applications. Featuring a 650V voltage rating and 30A continuous current capacity, this device offers efficient switching and robust thermal management. Its advanced planar gate technology ensures low conduction and switching losses, enhancing overall system efficiency. The STGP30M65DF2 supports high-speed operation with reliable avalanche energy capability, making it ideal for inverter circuits, motor drives, and power supplies. Engineered for durability and consistent performance under harsh electrical and thermal stresses, this IGBT is a versatile choice for engineers seeking optimized power control solutions from IC Manufacturer.
STGP30M65DF2 Technical Specifications
| Parameter | Value |
|---|---|
| Collector-Emitter Voltage (Vces) | 650 V |
| Continuous Collector Current (Ic) | 30 A |
| Gate-Emitter Voltage (Vge) | ??20 V |
| Power Dissipation (Ptot) | 250 W |
| Junction Temperature Range (Tj) | -55 ??C to +150 ??C |
| Turn-On Delay Time (td(on)) | ~40 ns |
| Turn-Off Delay Time (td(off)) | ~150 ns |
| Collector-Emitter Saturation Voltage (Vce(sat)) | 1.6 V (typical) |
| Device Package | TO-247 |
STGP30M65DF2 Key Features
- Low conduction losses: The device??s optimized chip design reduces voltage drop, improving energy efficiency and thermal performance in power switching applications.
- High avalanche energy capability: Ensures robust operation during inductive load switching, enhancing device reliability and system protection.
- Fast switching times: Minimizes switching losses, enabling high-frequency operation and improved overall system efficiency.
- Wide operating temperature range: Supports reliable performance in harsh industrial environments, increasing device lifespan and reducing maintenance.
Typical Applications
- Industrial motor drives requiring efficient power switching and thermal stability for variable speed control and energy savings.
- Inverter modules for renewable energy systems, including solar and wind power, where reliable high-voltage switching is critical.
- Switch-mode power supplies (SMPS) demanding high efficiency and robust thermal management for stable power delivery.
- Uninterruptible power supplies (UPS) and industrial power conversion systems that benefit from low switching losses and high avalanche capability.
STGP30M65DF2 Advantages vs Typical Alternatives
This device offers a superior balance of low conduction losses and fast switching speeds compared to many conventional IGBTs, reducing overall power dissipation and improving energy efficiency. Its robust avalanche energy rating and wide junction temperature range enhance reliability under tough industrial conditions. The TO-247 package facilitates effective thermal management and easy integration, making it a preferred choice for engineers focused on performance and durability.
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STGP30M65DF2 Brand Info
The STGP30M65DF2 is a product from STMicroelectronics, a global leader in semiconductor manufacturing. STMicroelectronics specializes in advanced power semiconductor devices, including IGBTs, MOSFETs, and power modules tailored for industrial and automotive applications. Known for innovation and quality, STMicroelectronics ensures this IGBT meets stringent performance, reliability, and efficiency standards critical for modern power electronics designs.
FAQ
What is the maximum voltage rating of the STGP30M65DF2?
The maximum collector-emitter voltage rating for this device is 650 volts, making it suitable for medium-voltage industrial power applications where reliable high-voltage switching is required.
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How does the STGP30M65DF2 perform in terms of switching speed?
This IGBT features fast switching characteristics with turn-on delay times around 40 nanoseconds and turn-off delay times approximately 150 nanoseconds, enabling efficient operation in high-frequency switching environments.
What package type does this IGBT use and why is it important?
The device comes in a TO-247 package, which offers excellent thermal dissipation and mechanical robustness. This package type simplifies heat sink attachment and improves reliability in high-power applications
