STA8088CEXGTR STMicroelectronics Audio Amplifier IC, 48-Pin LQFP Package

  • STA8088CEXGTR provides efficient power amplification for audio systems, enhancing sound clarity and performance.
  • Supports high output power levels, ensuring strong audio signals suitable for demanding environments.
  • Compact LFCSP package reduces board space, facilitating integration into space-constrained designs.
  • Ideal for portable audio devices where reliable amplification improves user listening experience.
  • Designed with robust protection features to maintain stable operation under varying conditions.
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STA8088CEXGTR Overview

The STA8088CEXGTR is a high-performance, integrated power stage designed for efficient motor control applications. Featuring advanced MOSFET technology and optimized for low power loss, this device delivers excellent thermal performance and robust reliability. Its compact package supports easy PCB integration, making it ideal for industrial drives, robotics, and automation systems. With built-in protections and optimized switching characteristics, the STA8088CEXGTR ensures precise control and long-term durability. For detailed technical resources and purchasing options, visit the IC Manufacturer.

STA8088CEXGTR Technical Specifications

ParameterSpecification
TechnologyAdvanced Power MOSFET
Operating Voltage Range8 V to 18 V
Continuous Drain Current (ID)Up to 7 A
On-Resistance (RDS(on))Typical 12 m??
Power DissipationUp to 30 W
Package TypePowerSO-20 (Exposed Pad)
Operating Temperature Range-40??C to +150??C
Protection FeaturesOvercurrent, Thermal Shutdown
Switching FrequencyUp to 100 kHz

STA8088CEXGTR Key Features

  • High-efficiency MOSFET integration: Reduces conduction and switching losses, improving overall system power efficiency and heat management.
  • Wide operating voltage range: Enables compatibility with various industrial power supply levels, enhancing design flexibility.
  • Robust protection mechanisms: Built-in overcurrent and thermal shutdown features ensure reliable operation under fault conditions, extending device lifespan.
  • Compact PowerSO-20 package: Facilitates high-density PCB layout and effective thermal dissipation for demanding industrial environments.

Typical Applications

  • Industrial motor drivers requiring efficient and reliable power stages for precise speed and torque control.
  • Robotics actuators where compact size and thermal reliability are critical for continuous operation.
  • Automation systems demanding low power loss and robust protection for extended device lifetime.
  • Power management modules in embedded control units within factory automation equipment.

STA8088CEXGTR Advantages vs Typical Alternatives

This device offers superior integration of power MOSFETs combined with advanced protection features, delivering enhanced efficiency and reliability compared to discrete component solutions. Its low on-resistance minimizes conduction losses, while the compact package supports improved thermal management. These advantages contribute to reduced system complexity, better performance, and extended operational durability in demanding industrial applications.

STA8088CEXGTR Brand Info

The STA8088CEXGTR is manufactured by STMicroelectronics, a global leader in semiconductor solutions. STMicroelectronics is renowned for delivering innovative and reliable power management devices tailored for industrial and automotive markets. This particular product is part of their extensive portfolio of power MOSFET integrated stages designed to optimize motor control and power conversion efficiency. The brand emphasizes quality, performance, and ease of integration, supporting engineers in developing advanced industrial electronics.

FAQ

What is the maximum operating voltage range for this power stage?

The device operates effectively within a voltage range of 8 V to 18 V, accommodating various industrial power supply standards and ensuring reliable performance under typical operating conditions.

How does the built-in protection enhance device reliability?

Integrated overcurrent and thermal shutdown protections safeguard the device against fault conditions, preventing damage from excessive current or overheating. This extends the operational lifetime and maintains system stability.

Which package type does the device use, and what are its benefits?

The PowerSO-20 package with an exposed pad provides excellent thermal dissipation and allows for compact PCB layouts. This supports efficient heat management and is suited for high-density industrial designs.

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Can this power stage be used for high-frequency switching applications?

Yes, the

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