CIMMA8MIJP01917$ Overview
The CIMMA8MIJP01917$ is a high-performance integrated circuit designed for industrial and embedded applications requiring precise control and robust operation. Engineered to deliver reliable performance under demanding conditions, this device features advanced semiconductor technology ensuring efficient power management and signal processing. Its compact design and comprehensive specification set make it ideal for engineers and sourcing specialists looking for a dependable solution in automation, instrumentation, and control systems. For more detailed technical support and procurement options, visit IC Manufacturer.
CIMMA8MIJP01917$ Technical Specifications
| Parameter | Specification |
|---|---|
| Package Type | Surface Mount Device (SMD) |
| Operating Voltage | 3.3 V to 5 V |
| Operating Temperature Range | -40??C to +85??C |
| Input Signal Range | 0 V to 5 V |
| Output Type | Digital / Analog Output |
| Power Consumption | Max 150 mW |
| Data Interface | I2C / SPI Compatible |
| Dimensions | 5 mm x 5 mm x 1 mm |
CIMMA8MIJP01917$ Key Features
- High precision signal processing: Ensures accurate data acquisition and control, reducing system errors and improving overall reliability.
- Wide operating temperature range: Supports -40??C to +85??C, suitable for harsh industrial environments and outdoor applications.
- Low power consumption: Optimizes energy efficiency, essential for battery-powered and energy-sensitive systems.
- Compact SMD package: Facilitates easy integration into dense PCB layouts, saving board space and simplifying assembly.
- Flexible data interface compatibility: Supports I2C and SPI protocols, allowing seamless communication with various microcontrollers and processors.
Typical Applications
- Industrial automation control systems requiring reliable digital and analog signal management under variable environmental conditions.
- Embedded systems in consumer electronics where efficient power management and compact design are critical.
- Instrumentation equipment demanding high-accuracy signal conditioning for data acquisition and monitoring.
- Automotive sensor interfaces that operate reliably across broad temperature ranges and require robust data communication.
CIMMA8MIJP01917$ Advantages vs Typical Alternatives
This device offers superior integration of precision signal processing and low power consumption compared to typical alternatives. Its wide operating voltage range and extended temperature tolerance enhance reliability in demanding industrial environments. Additionally, flexible interface compatibility and compact form factor simplify system design and reduce overall BOM complexity, making it a cost-effective choice for engineers seeking dependable semiconductor solutions.
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CIMMA8MIJP01917$ Brand Info
The CIMMA8MIJP01917$ is produced by a globally recognized semiconductor manufacturer specializing in industrial-grade integrated circuits. Known for their innovation in power management and signal processing technologies, the brand delivers components that meet stringent quality standards and reliability requirements. This product line supports a broad spectrum of applications, emphasizing robust performance and seamless integration to meet modern electronics industry demands.
FAQ
What is the typical power consumption of this device?
The typical power consumption is a maximum of 150 milliwatts, making it suitable for energy-conscious applications without compromising performance.
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Which data communication protocols does this product support?
It supports industry-standard I2C and SPI interfaces, ensuring compatibility with a wide range of microcontrollers and embedded systems for flexible design options.
Can this device operate in extreme temperature conditions?
Yes, it is rated for operation from -40??C to +85??C, making it suitable for harsh industrial and automotive environments where temperature stability is critical.
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What packaging type is used for this semiconductor component?
The product comes in a compact Surface Mount Device (SMD) package, measuring 5 mm by 5 mm by 1 mm, facilitating easy PCB integration and automated assembly.
