RY211012 High-Performance Voltage Regulator Module – Compact Pack

  • Provides efficient signal processing to enhance system performance and reduce latency in embedded applications.
  • Features a high-speed interface that supports rapid data transfer, critical for real-time operations.
  • Encased in a compact package, it offers board-space savings suitable for dense circuit layouts.
  • Ideal for industrial automation, improving control accuracy and system responsiveness under varying conditions.
  • Manufactured with stringent quality controls to ensure consistent operation and long-term reliability.
产品上方询盘

RY211012 Overview

The RY211012 is a high-performance semiconductor component designed for precision industrial applications requiring reliable operation under diverse environmental conditions. Engineered for enhanced integration and optimized power efficiency, it delivers consistent functionality with minimal thermal dissipation. Its compact footprint supports dense PCB layouts, facilitating streamlined system designs. This device is well-suited for engineers and sourcing specialists seeking robust solutions with proven electrical characteristics. For detailed technical resources and support, visit the IC Manufacturer website.

RY211012 Technical Specifications

ParameterSpecification
Operating Voltage Range3.0 V to 3.6 V
Maximum Operating Current120 mA
Operating Temperature Range-40??C to +85??C
Package TypeQFN 16-pin, 4×4 mm
Input Signal FrequencyUp to 50 MHz
Output Logic LevelsTTL Compatible
Propagation Delay8 ns (typical)
Power Dissipation450 mW (max)

RY211012 Key Features

  • Wide voltage operating range: Ensures compatibility with various power supply designs, allowing flexible integration into existing systems.
  • High-speed signal processing: Supports input frequencies up to 50 MHz, enabling precise timing and control in high-frequency applications.
  • Low power consumption: Minimizes thermal output and extends device longevity, which is crucial for energy-conscious industrial environments.
  • Compact QFN package: Saves PCB space and enhances thermal performance, facilitating high-density circuit designs.

RY211012 Advantages vs Typical Alternatives

This device offers superior operating voltage flexibility and faster propagation delay compared to many conventional semiconductor components. Its low power dissipation improves system efficiency and reliability, while the compact package supports advanced PCB layouts. These advantages make it a preferred choice for engineers prioritizing performance, integration ease, and thermal management in industrial electronics.

Typical Applications

  • Industrial control systems requiring precise timing and low power consumption, such as programmable logic controllers and automated machinery interfaces.
  • Signal conditioning circuits in communication equipment, where high-frequency input handling is essential.
  • Embedded system boards demanding compact semiconductor components with reliable operation across wide temperature ranges.
  • Power management modules that benefit from reduced thermal output and stable voltage operation.

RY211012 Brand Info

The RY211012 is produced by a leading semiconductor manufacturer known for delivering high-quality integrated circuits tailored to industrial applications. This product exemplifies the brand??s commitment to combining advanced technology with robust design principles. It benefits from meticulous quality control and comprehensive technical documentation, making it a dependable choice for engineers and sourcing specialists aiming for reliable, efficient system integration.

FAQ

What is the maximum operating temperature for this component?

The maximum operating temperature is +85??C, making it suitable for a wide range of industrial environments. It ensures reliable performance without thermal degradation within this temperature limit.

Can this device handle high-frequency input signals?

Yes, it supports input frequencies up to 50 MHz, enabling its use in applications requiring fast signal processing and precise timing control.

What package type does this component come in?

It is available in a 16-pin QFN package with a 4×4 mm footprint. This compact package facilitates dense PCB layouts and improved thermal dissipation.

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产品中间询盘

How does the power consumption affect the overall system design?

The low power dissipation of up to 450 mW reduces heat generation, which simplifies thermal management and contributes to increased system reliability and energy efficiency.

Is this device compatible with standard logic levels?

Yes, the output logic levels are TTL compatible, ensuring straightforward integration with most digital logic circuits and controllers.

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