QCN-6432-1-DRQFN132-TR-01-0 Wi-Fi/BT Combo SoC DRQFN132 Package

QCN-6432-1-DRQFN132-TR-01-0 Overview

The QCN-6432-1-DRQFN132-TR-01-0 is a high-pin-count surface-mount part identified by a 132-pin DRQFN package and tape-and-reel shipment format. The part number encodes series and variant details useful for BOM control, procurement, and assembly. Its 132 leads offer more I/O density than many 64 or 100-pin packages, enabling denser board layouts and more signals per footprint. Designed for automated placement, the tape-and-reel suffix helps reduce handling time and improve pick-and-place throughput. For distributor and datasheet reference visit IC Manufacturer.

QCN-6432-1-DRQFN132-TR-01-0 Technical Specifications

QCN-6432-1-DRQFN132-TR-01-0 Key Features

• 132-pin DRQFN package delivers increased I/O density for complex multi-signal designs, reducing the need for larger or multiple packages.
• Tape-and-reel packaging supports automated pick-and-place assembly, lowering handling time and improving throughput for high-volume production.
• Low-profile surface mount form factor enables tighter vertical stack-up and smaller overall PCB area compared to through-hole or QFP alternatives.
• Explicit part-code variant (6432-1) simplifies BOM matching and procurement control by distinguishing revision or configuration at the SKU level.

Typical Applications

• High-density PCB modules that require a 132-pin surface-mount footprint to consolidate multiple I/O functions into a single package for space-limited enclosures.
• Automated assembly lines that rely on tape-and-reel components to maximize pick-and-place efficiency and reduce per-unit handling for medium to high volumes.
• System controllers and interface hubs where a greater number of pins provide more signal routing options and reduce the need for external multiplexers or connectors.
• Compact industrial or telecom equipment where low-profile DRQFN packages help maintain board height limits while delivering higher connector counts on a single IC.

QCN-6432-1-DRQFN132-TR-01-0 Advantages vs Typical Alternatives

The DRQFN132 option offers denser pinout compared to 64- or 100-pin packages, enabling more signals within a similar footprint and simplifying board-level routing. Tape-and-reel packaging reduces manual handling relative to bulk or tray formats, improving assembly yield and cycle time. The explicit part suffix supports clearer BOM control and faster sourcing compared with generically coded SKUs. Overall, this configuration favors designs where higher I/O count and automated assembly are priority requirements.

QCN-6432-1-DRQFN132-TR-01-0 Brand Info

The QCN-6432-1-DRQFN132-TR-01-0 follows a QCN product-family style identifier used by the supplying vendor. The part-number structure signals series, variant, package, and packaging format for supply-chain traceability. For exact manufacturer identity, mark, and datasheet details, consult the original vendor documentation or an authorized distributor to confirm corporate branding and production status.

FAQ

What package type is used?

This part uses a DRQFN package style, which is a low-profile, surface-mount rectangular package with leads configured for PCB soldering and high pin density.

How many pins does it have?

The device is specified with 132 pins. That pin count supports higher I/O density and allows more signal connections than lower-pin-count packages on a single footprint.

Is it shipped for automated assembly?

Yes. The -TR suffix indicates tape-and-reel packaging intended for automated pick-and-place equipment, which helps reduce manual handling and speeds high-volume assembly.

How does the part code help procurement?

The alphanumeric code encodes series (6432), variant (1), package (DRQFN132), and packaging (-TR-01-0). This makes BOM matching and supplier queries more precise for purchasing teams.

Where can I find the datasheet?

Refer to the component vendor or authorized distributor for the official datasheet and mechanical drawing. The part number shown must match vendor documentation for accurate electrical, thermal, and footprint specifications.