QCN-6432-1-DRQFN132-MT-01-0 Wi-Fi/Bluetooth Combo SoC, DRQFN132 Package

QCN-6432-1-DRQFN132-MT-01-0 Overview

The QCN-6432-1-DRQFN132-MT-01-0 is a high-density integrated-circuit offering presented in a DRQFN package with a 132-pin count. The part number encodes series, variant and packaging details that make it suitable for compact, multi-signal board designs. It is optimized for automated surface-mount assembly and tape-and-reel handling indicated by the MT-01-0 suffix. For ordering, compliance and full datasheet reference visit IC Manufacturer.

QCN-6432-1-DRQFN132-MT-01-0 Technical Specifications

QCN-6432-1-DRQFN132-MT-01-0 Key Features

• High pin density: 132 pins provide more I/O lanes compared with lower-pin packages, enabling greater signal routing and integration.
• Compact DRQFN footprint: smaller board area than many BGA or PQFN alternatives, which reduces PCB cost and conserves board space.
• Surface-mount friendly: package supports automated pick-and-place and reflow soldering for higher volume assembly and consistent yields.
• Tape-and-reel packing code included: MT-01-0 indicates readiness for reel handling, improving logistics for large production runs.

Typical Applications

• High-density interface controllers where a 132-pin DRQFN supports multiple high-speed lines and dense peripheral connections on compact PCBs.
• Embedded processing modules that require more I/O than 64- or 80-pin packages while retaining a smaller footprint than many 200+ pin devices.
• Networking and communications equipment where board space and robust surface-mount assembly are prioritized for volume manufacturing.
• Industrial control systems that benefit from higher pin counts to connect sensors, actuators and bus interfaces without moving to larger packages.

QCN-6432-1-DRQFN132-MT-01-0 Advantages vs Typical Alternatives

The DRQFN132 option delivers a clear trade-off: more pins and tighter routing than 64?C100 pin packages, yet a lower profile and smaller PCB area than many 200+ pin BGAs. It offers better thermal contact and simpler assembly than large BGAs, while the MT-01-0 packing code supports high-volume tape-and-reel processing. Engineers get higher integration density and easier manufacturability when comparing this package to bulkier or lower-pin alternatives.

QCN-6432-1-DRQFN132-MT-01-0 Brand Info

The QCN- prefix is used by established semiconductor vendors for integrated connectivity and system ICs. This part aligns with a manufacturer profile that emphasizes high-density packaging, production-grade tape-and-reel options, and support for automated surface-mount assembly. Contact the vendor listed on the official product page for certificate, lifecycle and approved distributor details.

FAQ

What does DRQFN132 indicate?

DRQFN132 denotes a dual-row QFN-style package configured with a total of 132 pins. It implies a low-profile, surface-mount package type designed for higher pin counts than many single-row QFN parts.

How many pins does this part have?

The part number explicitly identifies a pin count of 132. That count defines its I/O capacity and routing density compared with lower-pin packages.

Is this part surface-mount compatible?

Yes. The DRQFN family is a surface-mount device suited for standard SMT board assembly processes including pick-and-place and reflow soldering for volume manufacturing.

What does MT-01-0 mean?

The MT-01-0 segment in the part number indicates a manufacturer-defined packing or production code. It commonly denotes tape-and-reel readiness and variant/lot identification for assembly lines.

How should I source detailed specs?

Refer to the manufacturer??s official datasheet or authorized distributor listing for electrical, thermal and mechanical specifications. Use the exact part number to ensure correct datasheet and compliance documents.