QCN-6422-0-DRQFN132-TR-01-0 Overview
The QCN-6422-0-DRQFN132-TR-01-0 is a board-level semiconductor part identified by a compact package code and clear reel packaging. The designation indicates a DRQFN132 package with 132 pins and a tape-and-reel shipping format (TR). This configuration supports higher I/O density in a low-profile, surface-mount footprint. Sourcing and assembly teams use the full ordering string to match footprint, pin count, and reel supply. For procurement and technical reference see IC Manufacturer.
QCN-6422-0-DRQFN132-TR-01-0 Technical Specifications
| Full part number | QCN-6422-0-DRQFN132-TR-01-0 |
| Package type | DRQFN132 (QFN-style) |
| Pin count | 132 pins |
| Mounting style | Surface-mount device (SMT) |
| Packaging method | Tape & Reel (TR) |
| Series identifier | 6422 series |
| Variant code | 01-0 |
| Device family prefix | QCN |
| Ordering unit | Reel (per TR suffix) |
| Typical board density | High I/O density (132 pins in QFN footprint) |
QCN-6422-0-DRQFN132-TR-01-0 Key Features
- High I/O density with 132 pins for more signals in less area, enabling compact board designs.
- DRQFN package offers a low-profile, surface-mount form factor that reduces vertical space compared with larger packages.
- Tape-and-reel (TR) packaging streamlines automated pick-and-place and reduces handling time in high-volume assembly.
- Clear part-string and variant code (01-0) simplify procurement and BOM control for repeatable sourcing and inventory management.
Typical Applications
- High-density control modules where a 132-pin QFN reduces PCB area and supports multiple I/O interfaces in compact embedded controllers.
- Automated assembly lines that require tape-and-reel packaged components for efficient pick-and-place and high-throughput SMT production.
- Multi-function communication modules that need a low-profile surface-mount footprint to fit into slimmer enclosures and stacked PCBs.
- Prototyping and production where consistent variant identification (01-0) helps purchasing teams match reels to design revisions and lifetime buys.
QCN-6422-0-DRQFN132-TR-01-0 Advantages vs Typical Alternatives
The DRQFN132 format delivers higher pin density while keeping a lower profile than many gull-wing or BGA alternatives. Compared with through-hole or larger packages, this option reduces board area and enables shorter signal paths. The TR suffix signals tape-and-reel supply, which is faster and more predictable for automated assembly than bulk packing. The explicit series and variant codes support clearer procurement, fewer mis-shipments, and tighter inventory control versus ambiguous part strings.
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QCN-6422-0-DRQFN132-TR-01-0 Brand Info
QCN-6422-0-DRQFN132-TR-01-0 is listed through IC Manufacturer distribution and product listings. The brand presentation emphasizes clear ordering data, standardized packaging, and board-level integration support. The supplier voice highlights supply-chain readiness and consistent reel-format supply for production-scale deployments.
FAQ
What does DRQFN132 mean?
DRQFN132 denotes a QFN-style package with 132 leads. It implies a low-profile, surface-mount form factor and a high I/O density suited to compact PCBs.
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Does TR indicate packaging?
Yes. The TR suffix stands for tape-and-reel packaging, which is intended for automated pick-and-place assembly and for ordering per reel quantities.
How many pins are on this part?
The part name explicitly includes 132, which refers to the pin count in the DRQFN132 package. Use the full datasheet for exact pad and pin assignments.
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Is this a surface-mount device?
Yes. The DRQFN package is a surface-mount device. It is designed for standard SMT assembly processes and reflow soldering on compatible footprints.
How should I reference this in a BOM?
Use the full ordering string QCN-6422-0-DRQFN132-TR-01-0 in the BOM to capture package, pin count, packaging method, and variant. That reduces procurement ambiguity and improves inventory matching.




