QCN-6422-0-DRQFN132-MT-01-0 Wi-Fi/Bluetooth Combo IC DRQFN132 Package

QCN-6422-0-DRQFN132-MT-01-0 Overview

The QCN-6422-0-DRQFN132-MT-01-0 is a discrete part string that identifies a 132-pin dual-row QFN package option intended for surface-mount assembly. The part string encodes model identifier 6422, a revision index of 0, a package code of DRQFN132, and a packaging/handling segment labelled MT-01-0. This entry-focused description helps engineers and sourcing specialists evaluate mechanical, packaging and procurement attributes before electrical datasheet lookup. For authorized-source verification and distributor matching, consult IC Manufacturer.

QCN-6422-0-DRQFN132-MT-01-0 Technical Specifications

QCN-6422-0-DRQFN132-MT-01-0 Key Features

• High pin density: 132 pins in a dual-row QFN footprint enable more I/O in a smaller board area, reducing PCB real estate by comparison with larger packages.
• Low-profile surface-mount form factor: DRQFN packaging supports compact z-height designs, which matters for stacked assemblies and space-constrained enclosures.
• Assembly-friendly code segments: the MT-01-0 segment signals a defined packaging/handling option to simplify procurement and automated placement workflows.
• Clear revision and model encoding: the numeric fields (6422 and revision 0) provide deterministic part identification for sourcing, inventory control and version management.

These features combine to give design and sourcing teams improved mechanical predictability: 132 leads concentrated in a QFN-style body commonly yield easier thermal-pad access and simpler rework than comparable BGA alternatives. The explicit packaging code in the part string allows rapid alignment with factory tape-and-reel or tray options during BOM creation.

Typical Applications

• High-I/O surface-mount modules where a 132-pin QFN footprint enables dense signal routing and compact PCB layouts for industrial control electronics and communications.
• Embedded processing or mixed-signal assemblies requiring many I/O lines in constrained enclosures, where board area savings directly reduce system size and enclosure cost.
• Automated pick-and-place production lines that demand clearly defined tape-and-reel or handling codes to minimize machine setup time and placement errors.
• Prototype and production workflows that rely on standard QFN reflow profiles and accessible thermal pads for controlled thermal dissipation and reliable solder joints.

QCN-6422-0-DRQFN132-MT-01-0 Advantages vs Typical Alternatives

The DRQFN132 option delivers a more compact mechanical footprint and lower profile compared with many equivalent-count BGA or large-PQFN packages, improving board-level routing and thermal-pad access. The numeric model and revision fields in the string make part traceability straightforward for purchasing and supply-chain systems. Because the string includes a specific packaging/handling code, it supports faster assembly setup and reduces mismatch risk versus parts that omit standardized packaging identifiers. These factors help shorten time-to-production and lower rework rates.

QCN-6422-0-DRQFN132-MT-01-0 Brand Info

The part string itself does not explicitly contain a manufacturer brand name. Sourcing specialists should correlate this exact string against distributor databases, manufacturer catalogs and authorized supplier records to confirm the originating brand and to obtain the electrical datasheet, qualification data and authorized lifecycle information before procurement or design freeze.

FAQ

What does DRQFN132 mean?

DRQFN132 denotes a dual-row QFN-style package with 132 leads. It identifies the mechanical family and lead count, which informs PCB footprint planning and assembly process development.

How many pins are on this part?

The part string encodes a lead count of 132. Use that number for footprint pin mapping, pad array planning and when allocating routing layers for differential or high-density signal pairs.

Does the string indicate packaging type?

Yes. The segment labeled MT-01-0 is a packaging/handling indicator in the full part string. Confirm the exact reel or tray specification with the distributor for machine compatibility.

Is this a surface-mount device?

Yes. The DRQFN family is a surface-mount package. Design the board for reflow soldering and include an appropriate thermal pad and solder-mask-defined land pattern consistent with QFN assembly best practices.

How should I confirm the correct datasheet?

Match the complete string QCN-6422-0-DRQFN132-MT-01-0 against manufacturer and distributor catalogs. Verify model identifier, revision index and packaging code to ensure the datasheet and reliability data correspond to the exact procurement item.