QCN-6412-0-DRQFN132-TR-01-0 Overview
The QCN-6412-0-DRQFN132-TR-01-0 is a board-mount integrated circuit ordering SKU that emphasizes a 132-pin DRQFN body and tape-and-reel shipment. The designation highlights a high-pin-count surface-mount format for compact assemblies. The part code embeds a product identifier (6412) and a package/revision signature (DRQFN132, TR, 01-0). For procurement and datasheet access see IC Manufacturer.
QCN-6412-0-DRQFN132-TR-01-0 Technical Specifications
| Parameter | Value |
| Part number | QCN-6412-0-DRQFN132-TR-01-0 |
| Product identifier | 6412 |
| Package family | DRQFN132 |
| Pin count | 132 |
| Package type | QFN (132 leads) |
| Mounting style | Surface-mount (SMD) |
| Ordering packaging | Tape & Reel (TR) |
| Revision code (major) | 01 |
| Revision code (minor) | 0 |
| Package pin/pad count (explicit) | 132 |
| Labeling and traceability | SKU includes TR and revision codes for tracking |
QCN-6412-0-DRQFN132-TR-01-0 Key Features
- High pin density: 132 pins allow more I/Os and power/ground distribution versus smaller-pin packages.
- Low-profile DRQFN body: reduces board stack height and improves mechanical integration in compact assemblies.
- Tape-and-reel packaging: supports automated pick-and-place lines and higher-volume surface-mount assembly throughput.
- Revision-coded SKU: 01-0 in the ordering code enables clear revision control for sourcing and inventory management.
Typical Applications
- Multilayer system boards where a 132-pin surface-mount IC is required for dense routing and compact mechanical envelopes, commonly in communication modules and gateways (??15 words).
- Automated production lines that require tape-and-reel packaging for high-volume placement and consistent reel tracking across SMT feeders and pick-and-place heads (??15 words).
- Prototyping and small-batch production where a QFN 132-pin component provides better thermal spreading and board-level routing compared with larger, taller packages (??15 words).
- Industrial control modules needing a high-pin-count SMD device for multiple signal, power, and ground connections while preserving low profile and reliable solder joints (??15 words).
QCN-6412-0-DRQFN132-TR-01-0 Advantages vs Typical Alternatives
The DRQFN132 form factor in this SKU offers denser pin count and a lower vertical profile compared with many SOIC or TQFP alternatives. That yields smaller board area and often improved thermal path through the exposed pad and short lead lengths. Tape-and-reel shipment supports automated placement and higher throughput versus tray-packed devices. Revision coding in the SKU improves traceability during supply-chain selection and reduces integration risk during design iterations.
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QCN-6412-0-DRQFN132-TR-01-0 Brand Info
The QCN-6412-0-DRQFN132-TR-01-0 listing appears under the manufacturer/distributor SKU entries used by commercial component suppliers. The designation encodes product identifier, package type, and packaging method to support procurement, inventory control, and supply-chain traceability for engineering and sourcing teams.
FAQ
What does DRQFN132 mean?
DRQFN132 indicates a discrete QFN-style package with 132 pins. The term DRQFN labels a low-profile, surface-mount package family optimized for dense routing and compact board layouts.
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What does the TR suffix indicate?
TR denotes tape-and-reel packaging. Tape-and-reel supports automated pick-and-place mounting and standard SMT line feeders for volume assembly and repeatable component placement.
How do I use the revision codes?
The revision codes “01-0” in the SKU are used for tracking specific part revisions. Use these codes to match procurement orders with the exact board-tested revision and to simplify change management.
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Is this a surface-mount device?
Yes. The package family and DRQFN designation indicate a surface-mount device intended for SMD placement and reflow soldering on printed circuit boards.
How does the 132-pin count affect PCB layout?
A 132-pin device increases routing density and requires careful footprint and breakout planning. Use multiple signal layers and controlled impedance routing to manage trace congestion and maintain signal integrity.



