QCN-6412-0-DRQFN132-MT-01-0 Wi-Fi/Bluetooth Combo IC, DRQFN132 Package

QCN-6412-0-DRQFN132-MT-01-0 Overview

The QCN-6412-0-DRQFN132-MT-01-0 is an integrated-circuit orderable identifier presented in a 132-pin DRQFN package. The part string documents a package code, a series index, a revision suffix and a lead finish code. This format helps engineers and sourcing specialists compare pin density, mounting style, and ordering traceability across similar parts. For distributor details and official ordering information, see IC Manufacturer.

QCN-6412-0-DRQFN132-MT-01-0 Technical Specifications

QCN-6412-0-DRQFN132-MT-01-0 Key Features

• High pin density: 132 pins provide more I/O count in a compact footprint for denser PCB routing and integration.
• Low-profile surface-mount packaging: DRQFN-style form factor supports low Z-height and improved board-level stacking compared to through-hole parts.
• Dual-row pad arrangement: the DR prefix indicates a multi-row pad layout that can simplify routing and maintain signal integrity on mid- to high-pin-count devices.
• Traceable ordering codes: explicit series, revision and finish codes (6412, 01-0, MT) enable clear procurement and lifecycle control for production and replacement.

Typical Applications

• Compact embedded controllers and microcontroller subsystems that require more than 100 I/Os while preserving a low profile on the PCB for space-constrained enclosures and modules.
• Industrial control and automation interfaces that need reliable surface-mount packaging with multi-row connections for robust signal routing on dense boards used in harsh environments.
• High-density mixed-signal modules where board real estate is limited and a 132-pin DRQFN offers a balance of thermal performance and routing access for analog and digital nets.
• Network and communication line cards that demand higher pin counts for multi-channel interfaces while minimizing package thickness and easing automated placement.

QCN-6412-0-DRQFN132-MT-01-0 Advantages vs Typical Alternatives

This DRQFN132-coded part offers a clear advantage in pin density versus lower-pin QFN packages, delivering up to twice the I/O in a similar or smaller board area. Compared with through-hole or gull-wing packages, the device enables lower profile assemblies and more efficient automated placement. The explicit series and revision codes support easier sourcing and rigour in BOM control, which helps teams reduce procurement errors and speed qualification.

QCN-6412-0-DRQFN132-MT-01-0 Brand Info

IC Manufacturer is presented as the source link for the part identifier. The brand voice here emphasizes clear ordering data, traceable part strings and engineering-ready package descriptors. Use the listed codes to match production requirements and to verify finish and revision details during quoting, qualification and production procurement.

FAQ

What is the package type?

The package type is DRQFN132. This indicates a QFN-style surface-mount package with the DR prefix and a 132-pin count, which is suitable for compact, low-profile board designs.

How many pins does it have?

The part string explicitly contains the number 132, which denotes a 132-pin device. Use that pin count when planning footprint routing and connector placement in the PCB layout.

What does MT indicate?

MT appears in the ordering string as a finish or code element. Treat it as a supply-chain identifier and confirm the exact lead finish and plating details with the distributor or datasheet before production.

Is this surface-mount or through-hole?

The DRQFN package is a surface-mount device type. It is intended for automated SMD pick-and-place and reflow processes on printed circuit boards.

How should I request documentation?

When sourcing, request the full datasheet, mechanical drawing and ordering matrix using the exact ordering code QCN-6412-0-DRQFN132-MT-01-0 to ensure correct revision, finish and footprint information for qualification and assembly.