QCN-6402-0-DRQFN132-MT-01-0 Wireless Combo IC DRQFN132 Package

QCN-6402-0-DRQFN132-MT-01-0 Overview

The QCN-6402-0-DRQFN132-MT-01-0 is a single part number that identifies a high-pin-count integrated circuit in a DRQFN132 package. The designation shows a 132-pin DRQFN format and a manufacturing variant code of 01-0. This part is optimized for dense board layouts and surface-mount assembly. For ordering and supplier details, reference the official listing at IC Manufacturer.

QCN-6402-0-DRQFN132-MT-01-0 Technical Specifications

QCN-6402-0-DRQFN132-MT-01-0 Key Features

• High pin density in a DRQFN132 footprint delivers more I/O per square millimeter for tighter board layouts and higher functional density.
• Surface-mount DRQFN format supports automated assembly and reduces board profile compared with through-hole or larger BGA alternatives.
• Variant traceability via the 01-0 code enables clearer production tracking and version control in contract manufacturing.
• QFN thermal path characteristics improve heat transfer to the PCB compared with plastic leaded packages, supporting higher local power dissipation.

Typical Applications

• High-density control modules where a 132-pin QFN package is required to route many signals and to save board area in compact industrial controllers.
• Embedded communication or interface adapters that demand numerous I/O lines and want a low-profile, surface-mount package for PCB real estate savings.
• Industrial sensor hubs and data-acquisition front ends that need a high pin count for parallel I/O, while maintaining robust thermal coupling to the PCB.
• Modular subsystem designs and small form-factor computing modules where QFN packaging supports both automated placement and dense signal routing.

QCN-6402-0-DRQFN132-MT-01-0 Advantages vs Typical Alternatives

The DRQFN132 form offers a clear advantage where pin count and board area compete. Compared with larger packages with similar I/O counts, this part enables more compact layouts and lower profile assemblies. Surface-mount DRQFN provides faster pick-and-place and reflow processing than through-hole parts. The explicit variant code 01-0 gives straightforward revision control versus generic single-code parts.

QCN-6402-0-DRQFN132-MT-01-0 Brand Info

IC Manufacturer supplies the QCN-6402-0-DRQFN132-MT-01-0 as part of its high-density package portfolio. The brand voice is focused on precision, traceability, and supply-chain readiness for engineering and sourcing teams specifying DRQFN devices for industrial and embedded designs.

FAQ

What package is used?

The device uses a DRQFN132 package designation. DRQFN132 indicates a QFN-style, low-profile surface-mount package with 132 external connections suitable for dense PCB routing.

How many pins does it have?

The part explicitly lists a 132 pin count as part of the DRQFN132 designation. That number defines the available external I/O pins for routing on the PCB.

What does the variant code mean?

The code 01-0 in the part string denotes a specific manufacturing or revision variant. For exact revision details, consult the manufacturer documentation or the product change notices.

Is it surface-mount compatible?

Yes. The DRQFN package and the MT designation indicate surface-mount compatibility and support standard pick-and-place plus reflow soldering processes common in modern production lines.

How should I order this part?

Order using the full part number QCN-6402-0-DRQFN132-MT-01-0 to ensure correct package and variant. Contact the listed manufacturer or an authorized distributor for availability, MOQ, and lead-time information.